photo detectors. [ 10 ] Similarly gravure printing has been used to fabricate circuits such as: complementary ring oscillators, [ 11 ] logic gates, [ 12 ] unipolar fl ip-fl ops and half-adders. [ 13,14 ] Although previous reports have combined gravure and inkjet printing to fabricate p-type organic fi eld-effect transistors (OFETs), [ 15 ] there is a lack of direct comparative studies of the impact of each process on the electrical performance of devices. Here, we explore gravure versus inkjet printing of semiconductors, gravure printing versus photolithographic patterning of the OFET dielectric, and long-channel (>1 µm) versus short channel (<1 µm) OFETs.Gravure printing enables very large-area, fast, roll-to-roll manufacturing, limited by the expense and time cost of fabricating clichés (printing plates). [ 16,17 ] Inkjet printing enables a computer-designed circuit to be printed readily and easily, limited by the relative throughput and speed of printing. [ 2 ] However, the resolution of both technologies is still restricted to the micrometer scale and larger by the challenge of reliably transferring inks onto a substrate without spreading or dewetting, while still maintaining electrical performance. While recent approaches are improving upon this limit, for example, the work of Kang et al. on gravure printed sub-5 µm gate electrodes, [ 18 ] or that of Sekitani et al. on 2 µm inkjet printed electrodes, [ 19 ] the options for patterning sub-micrometer electrode geometries are limited.We have previously demonstrated how ultraviolet nanoimprint lithography (UV-NIL) is a viable method for patterning sub-micrometer channel length OFETs on plastic. [ 20 ] Our approach also uses self-aligned lithography to minimize the overlap between the gate-source and gate-drain electrodes, reducing parasitic overlap capacitances that reduce the switching speed of OFETs. [ 21,22 ] Self-alignment yields other benefi ts such as overcoming equipment alignment tolerances, reducing leakage currents, and is compatible with more complex circuitry such as self-aligned unipolar ring oscillators. [ 23 ] In this work, we have used bottom-gate bottom-contact architectures, to avoid exposing the semiconductor to both the ultraviolet light and processing chemicals used for self-alignment. In addition to self-alignment, here we extend the fabrication approach further by incorporating gravure printed dielectrics and semiconductors, as well as inkjet printed semiconductors. We demonstrate both p-and n-type devices patterned side-by-side on the same substrate along with complementary inverters and logic gates. Figure 1 illustrates the materials and architectures used in this work. Aluminum OFET gates were patterned either photolithographically (PL) or via UV-NIL. A cross-linkable proprietary dielectric (GSID 938109-1, BASF) [ 24,25 ] was either PL patterned or gravure printed. Self-aligned gold electrodes were patterned Organic electronics is a maturing fi eld, [ 1 ] replete with a large variety of devices and fabrication technologies. [ 2 ] Often...