The new communication systems demand low‐cost, low‐profile, low‐weight, and high‐performance components (filters, diplexers, power dividers, antennas, etc.). Classical microwave technologies are either high performance but bulky and expensive (rectangular waveguides) or low cost and low profile but with poor performance (planar lines such as microstrip). Recently, an alternative has appeared by implementing a sort of rectangular waveguide embedded in a printed circuit board. It is the substrate‐integrated waveguide. Many attention has been given to this technology, but its performance can be further improved if the dielectric is removed and the fields propagate through air. So, several types of the so‐called empty substrate‐integrated waveguides have recently appeared, providing with very promising solutions for low‐cost and low‐profile devices with performance close to that of the classical rectangular waveguides.This article presents all the advances up to date in the field of empty substrate‐integrated waveguides, comparing all those solutions and assessing their potential for implementing high‐quality and low‐cost microwave devices.