High-performance Distributed Power Electronics Communication Network Design with 5 Gbps Data Rate and Sub-nanosecond Synchronization Accuracy

Yu, Ronghai; Shen, Z. John; Fan, Boran; Mitrovic, Vladimir; Yu, Jianghui; Mocevic, Slavko; Wang, Jun; Boroyevich, Dushan; Burgos, Rolando

doi:10.1109/ecce47101.2021.9595693

Cited by 9 publications

(2 citation statements)

References 13 publications

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“…More details about distribution, control layer partition and its mapping with physical control hardware, synchronization and temporal sequencing can be found in ref. [77].…”

Section: High-speed High-performance Communication Networkmentioning

confidence: 99%

Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter

Mocevic

Fan

et al. 2022

iEnergy

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Simultaneously imposed challenges of high-voltage insulation, high dv/dt, high-switching frequency, fast protection, and thermal management associated with the adoption of 10 kV SiC MOSFET, often pose nearly insurmountable barriers to potential users, undoubtedly hindering their penetration in medium-voltage (MV) power conversion. Key novel technologies such as enhanced gatedriver, auxiliary power supply network, PCB planar dc-bus, and high-density inductor are presented, enabling the SiC-based designs in modular MV converters, overcoming aforementioned challenges. However, purely substituting SiC design instead of Sibased ones in modular MV converters, would expectedly yield only limited gains. Therefore, to further elevate SiC-based designs, novel high-bandwidth control strategies such as switching-cycle control (SCC) and integrated capacitor-blocked transistor (ICBT), as well as high-performance/high-bandwidth communication network are developed. All these technologies combined, overcome barriers posed by state-of-the-art Si designs and unlock system level benefits such as very high power density, high-efficiency, fast dynamic response, unrestricted line frequency operation, and improved power quality, all demonstrated throughout this paper.

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“…More details about distribution, control layer partition and its mapping with physical control hardware, synchronization and temporal sequencing can be found in ref. [77].…”

Section: High-speed High-performance Communication Networkmentioning

confidence: 99%

Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter

Mocevic

Fan

et al. 2022

iEnergy

Self Cite

View full text Add to dashboard Cite

show abstract

“…The challenges in such communication structures range from high throughput and low data latency to precise synchronisation between the individual modules. The importance of precise synchronisation between the individual modules has been addressed in several papers [5]- [8] and many of them apply concepts similar to the precision time protocol (PTP) [9]. With respect to distributed modulation (e.g.…”

Section: Introductionmentioning

confidence: 99%

Fieldbus Communication Scheme for Modular Converter Systems - Considerations for Minimal Switching Period and Low Data Latency

Rietmann

Fuchs

Beck

et al. 2022

2022 IEEE Energy Conversion Congress and Exposition (ECCE)

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High Power Density 10 kV SiC MOSFET-Based Modular, Scalable Converter for Medium Voltage Applications

Mocevic

Fan

et al. 2022

2022 IEEE Applied Power Electronics Conference and Exposition (APEC)

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High-performance Distributed Power Electronics Communication Network Design with 5 Gbps Data Rate and Sub-nanosecond Synchronization Accuracy

Cited by 9 publications

References 13 publications

Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter

Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter

Fieldbus Communication Scheme for Modular Converter Systems - Considerations for Minimal Switching Period and Low Data Latency

High Power Density 10 kV SiC MOSFET-Based Modular, Scalable Converter for Medium Voltage Applications

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