2023
DOI: 10.1021/acsami.2c23275
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High Performance Epoxy Composites Containing Nanofiller Modified by Plasma Bubbles

Abstract: The thermal conductivity of polymer materials is a fundamental parameter in the field of high-voltage electrical insulation. When the operating frequency and power for electrical equipment or electronic devices increase significantly, the internal heat will increase dramatically, and the accumulation of heat will further lead to insulation failure and serious damage of the whole system. The addition of filler with high thermal conductivity into polymer is a common solution. However, the interfacial thermal res… Show more

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Cited by 9 publications
(4 citation statements)
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“…By incorporating thermal conductive fillers, the material's thermal conductivity can be enhanced, thereby yielding more optimal new composites for electronic packaging. 19,20 As a semiconducting material, SiC offers not only superior thermal conductivity but also imparts extraordinary properties onto polymers, including increased hardness and wear resistance. [21][22][23][24][25] 26 With the continual escalation of filler content, the thermal conductivity of polymer composites is boosted.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…By incorporating thermal conductive fillers, the material's thermal conductivity can be enhanced, thereby yielding more optimal new composites for electronic packaging. 19,20 As a semiconducting material, SiC offers not only superior thermal conductivity but also imparts extraordinary properties onto polymers, including increased hardness and wear resistance. [21][22][23][24][25] 26 With the continual escalation of filler content, the thermal conductivity of polymer composites is boosted.…”
Section: Introductionmentioning
confidence: 99%
“…Incorporating inorganic filler particles into materials can significantly improve their thermal conductivity, notable examples being graphene, 12,13 graphite, 14 boron nitride, 15–17 silicon carbide (SiC), 18 and so on. By incorporating thermal conductive fillers, the material's thermal conductivity can be enhanced, thereby yielding more optimal new composites for electronic packaging 19,20 …”
Section: Introductionmentioning
confidence: 99%
“…Alternatively, materials with lower SEY emit fewer SEs and hence accumulate less surface charge. The last two strategies usually focus on chemical modifications including composite coating, , doping of functional fillers, , fluorination, plasma treatment, and so on and are considered applicable for flexible films. Though manipulating surface charges has proven effective in mitigating flashover, the underlying mechanisms remain elusive.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the rapid population expansion and environmental concerns, problems related to energy crisis have become one of the most urgent issues in the 21 st century, which lends itself to the development of thermal management and energy storage systems. [1,2] Polymer materials characterized by lightweight, good electrical insulation performance, flexibility, and design freedom are good candidates for these applications. [3,4] However, the low intrinsic thermal conductivity significantly limits their applicability where fast heat conduction is needed.…”
Section: Introductionmentioning
confidence: 99%