2018
DOI: 10.1016/j.jallcom.2017.10.200
|View full text |Cite
|
Sign up to set email alerts
|

High-performance GaN-based light emitting diodes grown on 8-inch Si substrate by using a combined low-temperature and high-temperature-grown AlN buffer layer

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
5
0
1

Year Published

2018
2018
2024
2024

Publication Types

Select...
10

Relationship

1
9

Authors

Journals

citations
Cited by 24 publications
(6 citation statements)
references
References 32 publications
0
5
0
1
Order By: Relevance
“…As Si is a decent reflector in the deep UV range 43 , 44 and highly electrical and thermal conductive, such a configuration could be a possible path of fabricating vertical AlGaN deep UV LEDs and offers a potential benefit of direct integration to other electronic components on Si. More importantly, due to the thickness of the AlN buffer layer is very thin, it can be removed easily by chemical wet etching, which is compatible with the fabrication process of vertical InGaN visible color LEDs on Si substrates 28 , 29 , 45 , 46 , allowing for the achievement of vertical AlGaN deep UV LEDs with ultimately high electrical and optical performance.…”
Section: Introductionmentioning
confidence: 99%
“…As Si is a decent reflector in the deep UV range 43 , 44 and highly electrical and thermal conductive, such a configuration could be a possible path of fabricating vertical AlGaN deep UV LEDs and offers a potential benefit of direct integration to other electronic components on Si. More importantly, due to the thickness of the AlN buffer layer is very thin, it can be removed easily by chemical wet etching, which is compatible with the fabrication process of vertical InGaN visible color LEDs on Si substrates 28 , 29 , 45 , 46 , allowing for the achievement of vertical AlGaN deep UV LEDs with ultimately high electrical and optical performance.…”
Section: Introductionmentioning
confidence: 99%
“…Thin AlN film was most commonly used as a buffer layer, especially with a Si substrate. 8,[20][21][22] The AlN buffer layer worked as a blocking layer for suppression of unwanted interfacial layer formation and also as a seed layer for growth of 1D GaN nanostructures. [23][24][25][26][27] Reference 26 showed that the AlN buffer layer improves the alignment of GaN NWs on a Si (111) substrate.…”
Section: Introductionmentioning
confidence: 99%
“…Основная проблема интеграции двух технологий -значительное рассогласование параметров кристаллических решеток и коэффициентов температурного расширения, что приводит к возникновению большого количества дефектов, неконтролируемым флуктуациям состава твердых растворов, отслаиванию и растрескиванию гетероструктур. Не менее важной проблемой в производстве мощных нитридных СВЧ-транзисторов является теплоотвод от приборов, рассеиваемая мощность которых составляет десятки ватт [1][2][3][4][5].…”
Section: Introductionunclassified