High-performance
In–Ga–Zn–O (IGZO) Schottky diodes (SDs) were
fabricated using hydrogenated IGZO (IGZO:H) at a maximum process temperature
of 150 °C. IGZO:H was prepared by Ar + O2 + H2 sputtering. IGZO:H SDs on a glass substrate exhibited superior
electrical properties with a very high rectification ratio of 3.8
× 1010, an extremely large Schottky barrier height
of 1.17 eV, and a low ideality factor of 1.07. It was confirmed that
the hydrogen incorporated during IGZO:H deposition increased the band
gap energy from 3.02 eV (IGZO) to 3.29 eV (IGZO:H). Thus, it was considered
that the increase
in band gap energy (decrease in electron affinity) of IGZO:H contributed
to the increase in the Schottky barrier height of the SDs. Angle-resolved
hard X-ray photoelectron spectroscopy analysis revealed that oxygen
vacancies in IGZO:H were much fewer than those in IGZO, especially
in the region near the film surface. Moreover, it was found that the
density of near-conduction band minimum states in IGZO:H was lower
than that in IGZO. Therefore, IGZO:H played a key role in improving
the Schottky interface quality, namely, the increase of Schottky barrier
height, decrease of oxygen vacancies, and reduction of near-conduction
band minimum states. Finally, we fabricated a flexible IGZO:H SD on
a poly(ethylene naphthalate) substrate, and it exhibited record electrical
properties with a rectification ratio of 1.7 × 109, Schottky barrier height of 1.12 eV, and ideality factor of 1.10.
To the best of our knowledge, both the IGZO:H SDs formed on glass
and poly(ethylene naphthalate) substrates achieved the best performance
among the IGZO SDs reported to date. The proposed method successfully
demonstrated great potential for future flexible electronic applications.