High-performance liquid metal cooling loops

Ghoshal, U.; Grimm, Daniela; Ibrani, S.; Johnston, Chad E.; Miner, A.

doi:10.1109/stherm.2005.1412153

Cited by 29 publications

(20 citation statements)

References 4 publications

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“…To valuate the performance of liquid metal cooling in the system level, Yan and Liu [108] conducted a theoretical analysis through the introduction of the compartment model. Similar to the above schematic, Ghoshal et al [88] reported their liquid metal cooling system using the EM pump to drive gallium coolant and its alloys. They tested the impingement with a Ga 61 In 25 Sn 13 Zn 1 liquid metal alloy as the working fluid.…”

Section: Experimental Phenomenamentioning

confidence: 87%

“…Aimed at the computer chip cooling, several proof-of-concept devices with different driving approaches were developed in the lab [20,21,100]. For commercial purpose, a prototype that use an EM pump to drive liquid metal fluids was devised by a corporation named NanoCoolers [88,99]. However, tremendous fundamental efforts should be made in this area.…”

Section: Applications and Practical Developmentsmentioning

confidence: 99%

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Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

148

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With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400-500 W/cm 2 , and are still steadily climbing. As a result, it is extremely hard to attain higher performance and reliability. Because the conventional conduction and forcedair convection techniques are becoming incapable in providing adequate cooling for sophisticated electronic systems, new solutions such as liquid cooling, thermoelectric cooling, heat pipes, vapor chambers, etc. are being studied. Recently, it was realized that using a liquid metal or its alloys with a low melting point as coolant could significantly lower the chip temperature. This new generation heat transfer enhancement method raised many important fundamentals and practical issues to be solved. To accommodate to the coming endeavor in this area, this paper is dedicated to presenting an overall review on chip cooling using liquid metals or their alloys as coolant. Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling. Meanwhile, principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated. Some new advancement in making a liquid metal cooling device will be discussed. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant.

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Section: Experimental Phenomenamentioning

confidence: 87%

Section: Applications and Practical Developmentsmentioning

confidence: 99%

Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

148

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“…al. [15] report heat transfer coefficients in excess of 10[W/cm 2 /K] for heat fluxes in excess of 10 3 [W/cm 2 ] for purposes of electronics cooling, a review of the state of the art [16] suggests that there is not any active research in spray cooling in the temperature regime of 500 [K] or greater, of primary interest for hypersonics.…”

Section: F Captive Transpirationmentioning

confidence: 99%

Two Phase Thermal Protection of the Hypersonic Leading Edge

Maxwell

Hoang²

2016

46th AIAA Thermophysics Conference

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Hypersonics is the flight regime characterized by conditions in which high temperature and extreme heat flux dominate the flow physics. This regime spans high speed aircraft around Mach 5 through atmospheric entry of spacecraft at Mach 25 to 30. Stagnation temperatures frequently climb into the many thousands of degrees, well beyond the melt temperature of any known materials. Conventional thermal protection systems for the most extreme conditions employ ablative shielding, making use of latent heat for phase transition and gaseous advection to maintain vehicle airframe temperatures to within a manageable range for the short duration of entry. More recently, space planes and high-lift entry vehicles have enabled significantly lower heating by bleeding off airspeed at higher altitudes before descending into the dense lower atmosphere. These lower heat fluxes are managed with temperature resistant, extremely-low-thermal-conductivity heat shields during the transient entry process. The concepts explored in the present work include variations on past efforts and incorporation of existing component technologies into new applications, particularly in the context of liquidvapor evaporation-condensation cycles for thermal energy transport. This paper is intended as concept map summary, providing flight conditions and feasibility for two-phase thermal protection systems, including conventional ablation, transpiration, internal spray cooling, thermosyphons and heat pipes, loop heat pipes, and solid-liquid phase change media. With heat transport demonstrated into the kilowatts per square centimeter, two-phase systems provide a promising class of reusable and continuous technologies for managing the extreme heat fluxes encountered by hypersonic vehicles. Nomenclature= entry vehicle reference area, [m 2 ] = leading edge wall thickness, [m] = drag coefficient, [-] = friction coefficient, [-] = Stanton number, [-] = lift coefficient, [-] = linear elasticity modulus, [Pa] = drag force, [N] = friction force, [N] = lift force, [N] = gravity, [m/s 2 ] ℎ = altitude, [m] ℎ ( ) = (adiabatic) wall enthalpy, [J/kg] = thermal conductivity, [W/(m-K)] = Boltzmann constant, [m 2 kg/(s 2 K)] 1 Mechanical Engineer, Thermal Systems and Analysis Section 2 Branch Head, Space Mechanics Systems Development Branch 3 President. / = lift to drag ratio, [-] = free stream Mach number, [-] = vehicle mass, [kg] = heating rate, [W] = flight dynamic pressure, [Pa] = wall heat flux, [W/m 2 ] = vehicle reference area, [m 2 ] = temperature, [K] = velocity, [m/s] = thermal diffusivity, [m 2 /s] = ballistic coefficient, [kg/m 2 ] /( / ) = equilibrium glide entry parameter, [-] = ratio of specific heats, [-] = heat dissipation efficiency, [-] = enthalpy of vaporization, [J/kg] Downloaded by PURDUE UNIVERSITY on June 24, 2016 | http://arc.aiaa.org | This material is declared a work of the U.S. Government and is not subject to copyright protection in the United States. AIAA Aviation = dynamic viscosity, [J/kg] = Poisson's ratio, [-] = density, [kg/m 3 ] = surface ...

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“…Due to their high thermal conductivity liquid metals present an excellent solution for high power density cooling challenges especially for power semi conductor devices. TABLE I shows the thermophysical properties of some liquid metals used in heat transfer applications and of water for comparison [6] In conduction pumps, the direct current is conducted into the fluid through electrodes that are typically attached to the outer wall of the duct containing the liquid metal; the direct magnetic field is created into the duct by permanent magnets. It represents a simple design, possessing no moving parts, and can easily be integrated into a cooling loop.…”

Section: Introductionmentioning

confidence: 99%

Study and realization of a high power density electronics device cooling loop using a liquid metal coolant

Tawk

Avenas

Kedous‐Lebouc

et al. 2011

2011 IEEE Energy Conversion Congress and Exposition

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Thermal management became the limiting factor in the development of high power electronic devices and new methods of cooling are required. Due to the low thermal conductivity of classical liquids (water, alcohols, dielectric fluids…), in many cases, the standard liquid cooling techniques cannot achieve the required cooling performances. Therefore the use of liquid gallium alloys whose thermal conductivity (approx. 28W/m/K) is 40 times greater than thermal conductivity of water, is introduced. In the first part of this paper, we present a numerical modeling and an experimental study of a minichannel liquid metal cooler. In these experiments, the working fluid is moved via an electromagnetic pump. Numerical and the experimental results are compared. Then we present a numerical study showing that the cooler performances depend largely on the thermal conductivity of its constitutive material. In the last part we present a numerical study of a silicon chip cooling. Simulations with different flow rates and heat powers were performed. The cooling capacity of the liquid metal is compared with that of the water cooling and very attractive results were obtained. The concept discussed in this paper is expected to provide a powerful cooling strategy for high power density electronic devices.

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High-performance liquid metal cooling loops

Cited by 29 publications

References 4 publications

Liquid metal cooling in thermal management of computer chips

Liquid metal cooling in thermal management of computer chips

Two Phase Thermal Protection of the Hypersonic Leading Edge

Study and realization of a high power density electronics device cooling loop using a liquid metal coolant

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