2020
DOI: 10.1039/d0py01281e
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High-performance non-volatile resistive switching memory based on a polyimide/graphene oxide nanocomposite

Abstract: Chemical structure of PI-GO, schematic structure of the ITO/PI-GO/Al device and its memory characteristics.

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Cited by 20 publications
(18 citation statements)
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“…It is attributed to the fact that ordered alignment of LC-GeF fillers forms a complete in-plane carbon layer network, which further limits the rotation space of the LC-PI molecular chains. 59 It can be seen from Figure 7b that the T HRI (266.6 °C) of pure PI film is slightly higher than that of pure LC-PI film (262.4 °C), which is due to the fact that a higher proportion of benzene rings in the molecular chains of PI molecular chain brings about slightly higher thermal stability. The T HRI (277.6 °C) of 15 wt % GeF/ LC-PI composite film is significantly higher than that of pure LC-PI film.…”
Section: ■ Results and Discussionmentioning
confidence: 89%
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“…It is attributed to the fact that ordered alignment of LC-GeF fillers forms a complete in-plane carbon layer network, which further limits the rotation space of the LC-PI molecular chains. 59 It can be seen from Figure 7b that the T HRI (266.6 °C) of pure PI film is slightly higher than that of pure LC-PI film (262.4 °C), which is due to the fact that a higher proportion of benzene rings in the molecular chains of PI molecular chain brings about slightly higher thermal stability. The T HRI (277.6 °C) of 15 wt % GeF/ LC-PI composite film is significantly higher than that of pure LC-PI film.…”
Section: ■ Results and Discussionmentioning
confidence: 89%
“…The T g of 15 wt % LC-GeF/LC-PI composite film is 349.2 °C, which is 16.4, 19.9, and 3.4 °C higher than the pure PI film, pure LC-PI film, and 15 wt % GeF/LC-PI composite film, respectively. It is attributed to the fact that ordered alignment of LC-GeF fillers forms a complete in-plane carbon layer network, which further limits the rotation space of the LC-PI molecular chains . It can be seen from Figure b that the T HRI (266.6 °C) of pure PI film is slightly higher than that of pure LC-PI film (262.4 °C), which is due to the fact that a higher proportion of benzene rings in the molecular chains of PI molecular chain brings about slightly higher thermal stability.…”
Section: Resultsmentioning
confidence: 94%
“…[14][15][16] Polymer memory materials can store data through the conversion between the low and high current states between two electrodes by the applied voltage, which can be assigned as "0" and "1" or "OFF" state and "ON" state. [17][18][19][20][21] In recent years, functional polyimides (PIs) are regarded as the most promising polymeric memory materials due to their excellent thermal resistance [22] , chemical stability [23] , mechanical durability [24] and flexibility [25] . More importantly, PIs with the special donor-acceptor (D-A) type molecular structures exhibiting stronger intramolecular and intermolecular charge transfer (CT) effects are more promising for the flexible memory devices.…”
Section: Introductionmentioning
confidence: 99%
“…To meet the increasing requirement of flexible RRAM devices, polymers as the active layer are more favorable than other organic materials due to their low cost, intrinsic flexibility and large area fabricating capability 14–16 . Polymer memory materials can store electronic data through the conversion between the low and high current states between two electrodes by the applied voltage, which can be assigned as “0” and “1” or “OFF” state and “ON” state 17–21 . In recent years, functional polyimides (PIs) were regarded as the most promising polymeric electronic memory materials due to their excellent thermal resistance, 22 chemical stability, 23 mechanical durability, 24 and flexibility 25 .…”
Section: Introductionmentioning
confidence: 99%