2023
DOI: 10.1021/acsami.2c19137
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High-Performance Skutterudite/Half-Heusler Cascaded Thermoelectric Module Using the Transient Liquid Phase Sintering Joining Technique

Abstract: Thermoelectric (TE) materials have made rapid advancement in the past decade, paving the pathway toward the design of solid-state waste heat recovery systems. The next requirement in the design process is realization of full-scale multistage TE devices in the medium to high temperature range for enhanced power generation. Here, we report the design and manufacturing of full-scale skutterudite (SKD)/half-Heusler (hH) cascaded TE devices with 49-couple TE legs for each stage. The automated pick-and-place tool is… Show more

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Cited by 12 publications
(6 citation statements)
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“…In past decades, different strategies to overcome the challenges of contact resistance in bulk TE devices have been developed [3,[13][14][15]17]. For instance, a direct bonding technique for hH TE devices was developed, which demonstrated negligible contact resistance and clear interface, thereby achieving good TE performance with thermal stability (Figure 4a) [14].…”
Section: Interface Design Minimizing Electrical and Thermal Contact R...mentioning
confidence: 99%
See 2 more Smart Citations
“…In past decades, different strategies to overcome the challenges of contact resistance in bulk TE devices have been developed [3,[13][14][15]17]. For instance, a direct bonding technique for hH TE devices was developed, which demonstrated negligible contact resistance and clear interface, thereby achieving good TE performance with thermal stability (Figure 4a) [14].…”
Section: Interface Design Minimizing Electrical and Thermal Contact R...mentioning
confidence: 99%
“…An optimized Ti/Ni/Au coating layers were developed for metallization as the diffusion barrier and electrode contact layers, and the Cu-Sn transient liquid phase sintering technique is utilized for SKD and hH stages, which provides a high strength bonding and very low contact resistance (Figure 4b). [13] Figure 4 Metallization techniques of TE devices. (a) Direct bonding technique [14].…”
Section: Interface Design Minimizing Electrical and Thermal Contact R...mentioning
confidence: 99%
See 1 more Smart Citation
“…Thermoelectric generators (TEGs) represent a direct energy conversion between heat and electricity, which shows promise in harvesting green energy from waste heat and provides an alternative to conventional cooling technology [8,9,[13][14][15][16][17][18]. TE conversion efficiency (η) of a TEG primarily depends on the TE material's dimensionless average figure of merit (zT avg ) under a temperature gradient (∆T = T h − T C ; T h and T C are the hot-side and cold-side temperature of a TEG device, respectively) as [19][20][21] follows:…”
Section: Introductionmentioning
confidence: 99%
“…However, assembly of these devices requires a complicated and energy-intensive process. Aside from the significant amount of research being done to develop new high-performance TE materials to replace Bi 2 Te 3 -based materials, a significant amount of research is also being done to develop new device architectures to improve power generation and energy conversion efficiency or to simplify and reduce the manufacturing cost for TEG modules …”
Section: Introductionmentioning
confidence: 99%