2021
DOI: 10.1016/j.jallcom.2020.157901
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High-performance Te-doped p-type MoS2 transistor with high-K insulators

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Cited by 13 publications
(15 citation statements)
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“…In another study, a transition from n‐type conductance to p‐type conductance is achieved by incorporating Te atoms into MoS 2 . [ 181 ] Inspiringly, a remarkable room‐temperature hole mobility of 182 cm 2 V −1 s −1 is realized. Most recently, a bipolar to p‐type transition has been revealed in a V x W 1− x Se 2 FET as the V content increases from 0% to 1.9%.…”
Section: D Layered Materials Alloys For Electronic Device Applicationsmentioning
confidence: 99%
“…In another study, a transition from n‐type conductance to p‐type conductance is achieved by incorporating Te atoms into MoS 2 . [ 181 ] Inspiringly, a remarkable room‐temperature hole mobility of 182 cm 2 V −1 s −1 is realized. Most recently, a bipolar to p‐type transition has been revealed in a V x W 1− x Se 2 FET as the V content increases from 0% to 1.9%.…”
Section: D Layered Materials Alloys For Electronic Device Applicationsmentioning
confidence: 99%
“…Recently, phototransistors based on WSe 2 and MoS 2 have shown promising avenues for optoelectronic devices, with promising carrier transport properties, high on/off ratio, high light absorption coefficient, scalable thickness down to the monolayer and, most significantly, easy to introduce doping [2,[5][6][7][8][9][10][11]. However, these devices have shown limited photoresponsivity and detectivity due to the weak built-in electric field formed between WSe 2 and MoS 2 [6,9,10].…”
Section: Introductionmentioning
confidence: 99%
“…Among 2D transition metal dichalcogenides (TMDs), p-doping techniques have been widely reported as an effective tool to manipulate the properties of heterostructure phototransistors, including chemical doping with XeF 2 vapors, PPh 3 /AuCl 3 , low-energy phosphorus implantation, Te and H 2 gas, electrostatic split-gate configuration, ozone treatment and UV/ozone treatments [11][12][13][14][15][16][17]. Additionally, n-doping techniques have also been reported, including electron beam lithography, self-assembled monolayer, triphenylphosphine, lithium fluoride, nitrogen, zinc oxide and alkali metal compound-promoted chemical vapor deposition (CVD) [18][19][20][21][22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%
“…However, MoS 2 FETs still suffer from large contact resistance due to Schottky barriers formed at the metal/MoS 2 interface as well as due to interlayer resistance and, even in their crystalline form, experience extrinsic mobility issues, such as charged impurity scattering, detrimental for applications. To alleviate contact resistance issues, low work function metals and N-type charge-transfer dopants have been investigated by several groups, but the contact resistance did not exhibit momentous reductions at RT (being reduced by a factor of ∼3 in the first case (i.e., from 3.3 to 1.1 kΩ·μm) and by a factor of ∼2 (i.e., from 56.61 to 26.65 kΩ·μm) in the second case) and only moderate channel mobilities (on the order of 24.7 cm 2 ·V –1 ·s –1 ) were achieved with these methods. , Considerable work has also been done in other directions, such as dielectric engineering, utilizing high-k materials to electrostatically reduce impurity scattering in MoS 2 devices. , …”
Section: Introductionmentioning
confidence: 99%
“…13,14 Considerable work has also been done in other directions, such as dielectric engineering, utilizing high-k materials to electrostatically reduce impurity scattering in MoS 2 devices. 15,16 In this work, we demonstrate an alternative path to competitive flexible MoS 2 devices, namely, shaping and using onsite high-performance hybrid (liquid/solid-state) MoS 2 channels directly inside amorphous precursors of relative impurity. To achieve this, a processing protocol involving low thermal budget annealing and ionic liquid doping is developed and applied.…”
Section: Introductionmentioning
confidence: 99%