2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) 2007
DOI: 10.1109/therminic.2007.4451762
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High-performance thermal interface technology overview

Abstract: An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall… Show more

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Cited by 21 publications
(11 citation statements)
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“…1 These thermal issues have spawned a global effort towards the development of novel TIMs with complex formulation and very high performance. [2][3][4] To work effectively in the emerging thermal environment, TIMs must conform to the mating surfaces under reasonable assembly pressures, have a thin bond line, and have low contact resistance with adequate bulk thermal conductivity. As TIM technology evolves, this combination of factors makes accurate quantification of the thermal characteristics of new generation materials difficult, as some of the most important quantities that need to be measured are dropping to levels below the uncertainty floor of conventional measurement methodologies.…”
Section: Introductionmentioning
confidence: 99%
“…1 These thermal issues have spawned a global effort towards the development of novel TIMs with complex formulation and very high performance. [2][3][4] To work effectively in the emerging thermal environment, TIMs must conform to the mating surfaces under reasonable assembly pressures, have a thin bond line, and have low contact resistance with adequate bulk thermal conductivity. As TIM technology evolves, this combination of factors makes accurate quantification of the thermal characteristics of new generation materials difficult, as some of the most important quantities that need to be measured are dropping to levels below the uncertainty floor of conventional measurement methodologies.…”
Section: Introductionmentioning
confidence: 99%
“…With the implementation of high-performance liquid and phase-change cooling strategies, this percentage becomes even greater. If the thennal management of an electronic device is inadequate, unacceptable temperature levels may be reached which can adversely affect device performance, reliability, and lifespan [7]. These thermal issues have spawned a global effort towards the development of exotic TIMs with complex formulations [1][2][3][6][7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…Extensive other researches have been reported about the test method of the thermal conductivity and thermal resistance of materials [3][4][5][6][7][8][9] . These testing methods can be used to measure and evaluate the thermal properties of PCM fabrics in static state.…”
Section: Introductionmentioning
confidence: 99%