It is shown that sub-THz images of a GaN/AlGaN RF power FET allow one to unambiguously identify which part of the device is operational, when we purposely disconnect different portions of the device from the power supply. The effect is explained by a combination of factors including the contact pad geometry, orientation of bonding wires, and distribution of channel current in different portions of the device and their impact on coupling of THz radiation into the device. This work paves the way for potential application of THz imaging for failure analysis of RF circuit. © The Author(s) 2-4 Many of these applications exploited the unique properties of terahertz radiation which include the transparency of common packaging materials, and unique spectral fingerprints of many chemicals in terahertz range. 5 Understanding the mechanism of coupling of radiation is another important application of THz imaging. [6][7][8] The resolution of the THz imaging in the free space is limited by the diffraction limit and could not be any smaller than a half of the wavelength. However, designing a specific metal layout at the surface may allow excitation of the evanescent THz waves, providing the subwavelength resolution imaging capability. Using a field effect transistor for sub-THz imaging was demonstrated in literature. 4,9,10 In this work, for the first time, the potential application of THz imaging for failure analysis of an RF circuit has been demonstrated. The shift of the THz images obtained for different configurations was explained by the effects of contact pad geometry and bonding wire orientation on coupling of sub-THz radiation and the sensitivity of photoresponse on drain voltage in each channel of the device. It was shown that small variation in the distribution of the total drain current between the channels would cause noticeable distortion of the sub-THz responsivity image of the device under study. Scanning images of different devices in the RF circuit and comparing them with the images of the etalon device, it will be possible to identify the defective devices, as well as the possible locations of defects. This will create an opportunity for the noninvasive and nondestructive failure analysis of power RF circuits using sub-THz radiation. With further increase in the frequency and the spatial resolution, the analysis of smaller devices will also become possible.
Experimental300 GHz CW radiation beam, modulated by a mechanical chopper with a modulation frequency of 200 Hz was focused on the device using a parabolic mirror. The radiation-induced voltage change at the drain of the device, caused by excitation and rectification of plasmonic oscillations in the device channel, 14,15 was recovered by a lock-in amplifier. The optics and the lock in technique used in this experiment, is similar to standard photodetection methods described in literature.
11-13The device was mounted on a 3D nanopositioning stage, which was movable in x,y and z directions by a computer program with a 1 μm resolution to record spatial varia...