High power and high sensitivity planar lightwave circuit module incorporating a novel passive alignment method

Nakagawa, Goji; Yamamoto, Tsuyoshi; Sasaki, S.; Norimatsu, M.; Yamamoto, Norio; Nosaka, T.; Terada, Kenji; Tanaka, Kazuhiro; Miura, Kazunori; Yano, M.

doi:10.1109/50.654985

Cited by 13 publications

(2 citation statements)

References 15 publications

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“…[1][2][3][4] In these packages, solder alloys are commonly employed for mounting active devices, such as laser diodes, on the substrate of the package. [1][2][3][4] In these packages, solder alloys are commonly employed for mounting active devices, such as laser diodes, on the substrate of the package.…”

Section: Introductionmentioning

confidence: 99%

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Park

Lee

et al. 2002

Journal of Elec Materi

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The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.

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Section: Introductionmentioning

confidence: 99%

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Park

Lee

et al. 2002

Journal of Elec Materi

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“…However hybrid integration suffers severely from the poor coupling of light from a source to a component. To overcome this problem, several passive and active alignment techniques have been suggested [1][2][3][4], but they all need sophisticated fabrication techniques for imple-mentation. Furthermore they are very much limited to a particular device geometry.…”

Section: Introductionmentioning

confidence: 99%

A free-space alignment technique for active optical waveguide components

Karim¹

2002

Semicond. Phys. Quantum Electron. Optoelectron.

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A waveguide-based demultiplexer with two multiple-layer filters

Yamauchi¹,

Koshihara²,

Nakano³

2005

Electron. Comm. Jpn. Pt. II

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SUMMARYAn optical waveguide with multilayer films with the characteristics of 1.31 µm reflection/1.55 µm transmission is analyzed by means of the beam propagation method. First, the power-conservation wide-angle beam propagation method for TM wave analysis is derived. In the process, the evaluation equation for the power is presented and its effectiveness is demonstrated. Next, the characteristics of the filter structure in which the vertex angle of the input and output waveguides is 45° are discussed. After the location of the effective reflection point in the filter is investigated, the wavelength dependence is discussed. It is shown that the difference in the characteristics of the two polarizations can be kept small if the vertex angle is 45°. In order to obtain wavelength separation characteristics with small polarization dependence in a structure with a 90° crossing angle of the input and output waveguides, a structure is presented in which two waveguides with multilayer films and a vertex angle of 45° are cascaded. It is demonstrated that a reflectivity of 98% can be realized for the TE wave and 88% for the TM wave. Finally, it is shown that 98% reflection/98% transmission can be realized for the TE wave and 95% reflection/94% transmission for the TM wave by inserting a spacer layer (1/2 wavelength layer) into the multilayer filter.

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High power and high sensitivity planar lightwave circuit module incorporating a novel passive alignment method

Cited by 13 publications

References 15 publications

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

A free-space alignment technique for active optical waveguide components

A waveguide-based demultiplexer with two multiple-layer filters

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