High power LED packaging

Karlicek, R. F.

doi:10.1109/cleo.2005.201771

Cited by 16 publications

(13 citation statements)

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“…Although there remain opportunities for further improvements in these parameters, the emergence of LEDs into a ubiquitous technology for general illumination will rely critically on cost effective techniques for integrating the active materials into device packages, interconnecting them into modules, managing the accumulation of heat during their operation, and spatially homogenizing their light output at desired levels of chromaticity. Existing commercial methods use sophisticated, high-speed tools, but which are based on conceptually old procedures that exploit robotic systems to assemble material mechanically diced from a source wafer, with collections of bulk wires, lenses, and heat sinks in millimeter-scale packages, on a device-by-device basis, followed by separate steps to form integrated lighting modules (6). The intrinsic features of such processes prohibit cost competitive realization of some of the most appealing configurations of LEDs for lighting, such as those that involve large collections of ultrasmall, thin devices distributed uniformly, but sparsely, over emissive areas of large modules that could serve as direct replacements for troffers currently used in fluorescent building lights.…”

mentioning

confidence: 99%

Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting

Kim

Brueckner

Song

et al. 2011

Proc. Natl. Acad. Sci. U.S.A.

232

187

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Properties that can now be achieved with advanced, blue indium gallium nitride light emitting diodes (LEDs) lead to their potential as replacements for existing infrastructure in general illumination, with important implications for efficient use of energy. Further advances in this technology will benefit from reexamination of the modes for incorporating this materials technology into lighting modules that manage light conversion, extraction, and distribution, in ways that minimize adverse thermal effects associated with operation, with packages that exploit the unique aspects of these light sources. We present here ideas in anisotropic etching, microscale device assembly/integration, and module configuration that address these challenges in unconventional ways. Various device demonstrations provide examples of the capabilities, including thin, flexible lighting "tapes" based on patterned phosphors and large collections of small light emitters on plastic substrates. Quantitative modeling and experimental evaluation of heat flow in such structures illustrates one particular, important aspect of their operation: small, distributed LEDs can be passively cooled simply by direct thermal transport through thin-film metallization used for electrical interconnect, providing an enhanced and scalable means to integrate these devices in modules for white light generation.gallium nitride | solid-state lighting | transfer printing I ndium gallium nitride-based (InGaN) blue light emitting diodes (LEDs) hold a dominant position in the rapidly growing solid-state lighting industry (1, 2). The materials and designs for the active components of these devices are increasingly well developed due to widespread research focus on these aspects over the last one and a half decades. Internal and external quantum efficiencies of greater than 70% (3) and 60% (3), respectively, with luminous efficacies larger than 200 lm∕W (4) and lifetimes of >50;000 h (5) are now possible. The efficacies (i.e., 249 lm∕W), exceed those of triphosphor fluorescent lamps (i.e., 90lm∕W), thereby making this technology an appealing choice for energy-efficient lighting systems (4). In particular, electricity consumption for lighting potentially could be cut in half using solid-state lighting (2). Although there remain opportunities for further improvements in these parameters, the emergence of LEDs into a ubiquitous technology for general illumination will rely critically on cost effective techniques for integrating the active materials into device packages, interconnecting them into modules, managing the accumulation of heat during their operation, and spatially homogenizing their light output at desired levels of chromaticity. Existing commercial methods use sophisticated, high-speed tools, but which are based on conceptually old procedures that exploit robotic systems to assemble material mechanically diced from a source wafer, with collections of bulk wires, lenses, and heat sinks in millimeter-scale packages, on a device-by-device basis, followed by separa...

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mentioning

confidence: 99%

Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting

Kim

Brueckner

Song

et al. 2011

Proc. Natl. Acad. Sci. U.S.A.

232

187

View full text Add to dashboard Cite

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“…It would generate stress concentration at the interface and may lead to delamination [17,50]. For example, the CTE mismatch between the silicone resin and other packaging materials for LED packaging is inevitable during thermal cycling.…”

Section: ) Interfacial Strengthmentioning

confidence: 99%

Reliability Engineering of High Power LED Packaging

Liu

Luo

2011

LED Packaging for Lighting Applications

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“…Applications from backlight, lighting to agricultural and medical ones are fast increasing in number [4]. As LED industry evolved, dome lenses aiming for higher optical efficiency were widely adopted hence created so called emitter type LED packages [5]. They serve as point-like light sources with higher efficiency, which makes them ideal for directional lighting fixtures.…”

Section: Introductionmentioning

confidence: 99%

Dispensed dome lens validation through optical simulations for high irradiance UV LED module

Liao

Lin

Chien

et al. 2014

2014 International Conference on Electronics Packaging (ICEP)

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Dome lens formation method through dispensing highly thixotropic encapsulant [1] has been introduced into LED industry for several years. It's cost-effective and concise in production flow, but not qualified yet when accurate optical properties are needed. Most of directional fixtures therefore require LED packages with precisely molded dome lenses, which need complex and expensive processes. In this paper, an optical model of LED package with dispensed dome lens is built for analysis. Variables including LED chip position, chip height and lens diameter are investigated through optical simulations. In order to validate the package with production deviations, ray files of the resulting packages are then applied to a linear collimator for high irradiance UV LED module as a test vehicle. The result shows that after intentionally designing for the process window in production, the package's light pattern is stable and its mean direction bias is below 2 degrees under deviations. Peak irradiance drops by 6.3% and total flux drops by 1% even in the corner case with surface mount technology (SMT) deviations in the linear collimator. It then leads to a conclusion that when dispensed dome lens has been well designed for process window, dispensed dome lens could be applied to lighting applications as well.

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High power LED packaging

Cited by 16 publications

References 0 publications

Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting

Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting

Reliability Engineering of High Power LED Packaging

Dispensed dome lens validation through optical simulations for high irradiance UV LED module

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