High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar

Fina, Antonio; Carlofelice, Alessandro Di; Paulis, Francesco de

doi:10.1109/access.2018.2876011

Cited by 22 publications

(7 citation statements)

References 21 publications

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“…As a key component in the electronic scanning array radar system, the T/R module undertakes the functions of signal amplification and transmission, amplitude, and phase control, etc [9][10][11] . Generally, it's composed of a radio frequency transceiver switch, low noise amplifier, power amplifier, digitally controlled phase shifter, digitally controlled attenuator, and power supply and control network.…”

Section: Introductionmentioning

confidence: 99%

A Carrier-free Miniaturized Ka-band T/R Module Design for Easy Automatic Assembly

Bai

2022

J. Phys.: Conf. Ser.

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A Ka-band four-channel T/R module for electronic scanning array radar is proposed in this paper, which is small in size, lightweight, easy to produce, and has good channel consistency. Adopting the open cavity design on both sides, the microwave signal and the power signal are completely isolated in space with good electromagnetic compatibility characteristics. Moreover, a “carrier-free” assembly scheme is proposed in this design, which removes the thermal matching carriers at the bottom of the MMIC chips used in traditional modules, simplifying the assembly process and achieving a high automation rate. The reliability of the scheme is verified by rigorous temperature shock and random vibration tests. The overall size of the module is 50 mm*84 mm*9.2 mm, and the weight of a single channel is only 17.5 g. The transmit saturated output power is greater than 21.5 dBm, and flatness is less than 0.8 dB. The receiving increase is greater than 7.5 dB, and flatness is less than 1 dB. The noise figure is better than 5.5 dB. The design ideas proposed in this paper have good generalization in the design of low-power T/R module.

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Section: Introductionmentioning

confidence: 99%

A Carrier-free Miniaturized Ka-band T/R Module Design for Easy Automatic Assembly

Bai

2022

J. Phys.: Conf. Ser.

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“…T/R module is the key building block in the entire active phased array systems. [13][14][15][16][17][18] For large-scale radar systems, often hundreds or even thousands of T/R modules are used in different platforms, accounting for nearly 45% of the total system cost. 19 According to the way of assembling, the T/R module can be divided into "brick" structures and "tile" structures.…”

Section: Introductionmentioning

confidence: 99%

“…T/R module is the key building block in the entire active phased array systems 13–18 . For large‐scale radar systems, often hundreds or even thousands of T/R modules are used in different platforms, accounting for nearly 45% of the total system cost 19 .…”

Section: Introductionmentioning

confidence: 99%

An 8 × 8 ultra‐wideband tightly coupled dipole active phased array

Chen

Wang

et al. 2022

Int J RF Mic Comp-Aid Eng

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An 8 Â 8 ultra-wideband tightly coupled dipole active phased array with 64 T/R modules is presented in this paper. The proposed active phased array with 64 T/R modules is able to operate over a 5:1 bandwidth (2.05 ~10.3 GHz) in receiving mode and 8 ~10 GHz in transmitting mode. The array utilized tightly coupled balanced antipodal dipole antenna elements, which exhibits excellent scanning performance (±60 in E plane, ±60 in D plane and ±45 in H plane) and low cross-polarization characteristic (<À28 dB at broadside). The tiled transmitting/receiving modules (T/R modules) can successfully control the amplitude and phase of the feeding signal in each active channel. Besides, the total gain of all channels in receiving mode and transmitting mode are 30 and 26.4 dB, respectively, which shows good performances in receiving and transmitting signals. A prototype of 16 Â 16 antenna array is fabricated.The central 8 Â 8 elements are active elements that are connected to 64 channels T/R module. The remaining elements are dummy elements that are connected to 50Ω loads to alleviate the edge effect. The measurements of central 8 Â 8 elements are taken after the assembling of the antenna array and T/R modules. Good performances are achieved and the application potential of this phased array system is also validated.

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“…In order to solve this problem, researchers focus on the attempts to integrate multi RF front-end devices into one compact module by using 3D packaging technology. Reference [1] introduces several multi-layer substrates which are commonly chosen for microwave or millimeter-wave 3D packaging process, like high temperature co-fired ceramic (HTCC) [2,3], low temperature co-fired ceramic (LTCC) [4][5][6], and organic substrate [7,8]. HTCC is often considered to be the lowest cost ceramic technology [9], but it suffers from a significant insertion loss due to the low conductivity of tungsten used as the metal of transmission, especially at mm-wave frequencies.…”

Section: Introductionmentioning

confidence: 99%

Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging

Zhou

Wang

et al. 2021

Electronics

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In this paper, a three-dimensional heterogenous-integrated (3DHI) wafer-level packaging (WLP) process is proposed, and a radio frequency (RF) front-end module with two independent ultra-high frequency (UHF) receiving channels are designed and implemented, which covers 400 MHz–600 MHz and 2050 MHz–2200 MHz respectively for unmanned aerial vehicle (UAV) applications. The module is formed by wafer-to-wafer (W2W) bonding of two high-resistivity silicon (HR-Si) interposers with embedded bare dies and through silicon via (TSV) interconnections. Double-sided deep reactive ion etching (DRIE) and conformal electroplating process are introduced to realize the high-aspect-ratio TSV connection within 290 µm-thick cap interposer. Co-plane waveguide (CPW) transmission lines are fabricated as the process control monitor (PCM), the measured insertion loss of which is less than 0.18 dB/mm at 35 GHz. The designed RF front-end module is fabricated and measured. The measured return loss and gain of each RF channel is better than 13 dB and 21 dB, and the noise figure is less than 1.5 dB. In order to evaluate the capability of the 3DHI process for multi-layer interposers, the module is re-designed and fabricated with four stacked high-resistivity silicon interposers. After W2W bonding of two pairs of interposers and wafer slicing, chip-to chip (C2C) bonding is applied to form a four-layer module with operable temperature gradient.

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High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar

Cited by 22 publications

References 21 publications

A Carrier-free Miniaturized Ka-band T/R Module Design for Easy Automatic Assembly

A Carrier-free Miniaturized Ka-band T/R Module Design for Easy Automatic Assembly

An 8 × 8 ultra‐wideband tightly coupled dipole active phased array

Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging

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