High Precision Numerical and Experimental Thermal Studies of Microelectronic Packages in Still Air Chamber Tests

Souare, Papa Momar; Touré, Mamadou Kabirou; Allard, S.; Borzou, Bijan; Sylvestre, Julien; Foisy, Benoit; Duchesne, Éric

doi:10.1109/estc.2018.8546346

Cited by 3 publications

(1 citation statement)

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“…The results presented in Figure 5 show that our two-way coupled methodology provides accurate estimates of the temperature fields for both the vertical and the horizontal orientations of the test vehicle. For more details on the validation of our numerical model, see reference [11].…”

Section: Comparison Of Numerical Results and Experimental Datamentioning

confidence: 99%

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Touré¹,

Souare²,

Sylvestre³

2021

JECTC

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A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of microelectronic packages subjected to natural convection heat transfer. An accurate estimate of the junction temperature, with an error of less than 1˚C, was obtained compared to the experimental data for the vertical and horizontal orientations of the test vehicle in the JEDEC Still Air configuration. The sensitivity study showed that to have an accurate estimate of the temperature, the following elements should be present in the thermal model: radiation heat transfer in natural convection cooling; a computational fluid dynamics analysis to find realistic convection coefficients; detailed models of the high conductivity elements in the direction of the heat flow towards the environment; and finally precise values for the thicknesses of layers and the thermal properties of the substrate and the printed circuit board.

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Section: Comparison Of Numerical Results and Experimental Datamentioning

confidence: 99%