2021
DOI: 10.1016/j.sse.2021.108027
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High-quality remote plasma enhanced atomic layer deposition of aluminum oxide thin films for nanoelectronics applications

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Cited by 14 publications
(6 citation statements)
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“…[34] The curing effect for D it by Alnealing was also expected to a certain extent, as reductions for Al=SiO 2 =Si-based structures are reported in earlier works. [5,15,19,34,43] Furthermore, a similar reduction in D it of Al/Al 2 O 3 =Si MOS structures with sputtered Al films was recently reported by Khosla et al [44] The improvement could be explained by hydrogen species, which diffuse to the oxide-semiconductor interface and terminate the dangling bonds at the interface, as done for SiO 2 =Si interfaces. [5,32,34,43,45] Those hydrogen species form, when water, introduced to the system as traces of moisture, reacts with the Al during annealing.…”
Section: Impact Of Alnealsupporting
confidence: 68%
“…[34] The curing effect for D it by Alnealing was also expected to a certain extent, as reductions for Al=SiO 2 =Si-based structures are reported in earlier works. [5,15,19,34,43] Furthermore, a similar reduction in D it of Al/Al 2 O 3 =Si MOS structures with sputtered Al films was recently reported by Khosla et al [44] The improvement could be explained by hydrogen species, which diffuse to the oxide-semiconductor interface and terminate the dangling bonds at the interface, as done for SiO 2 =Si interfaces. [5,32,34,43,45] Those hydrogen species form, when water, introduced to the system as traces of moisture, reacts with the Al during annealing.…”
Section: Impact Of Alnealsupporting
confidence: 68%
“…For all our samples, we observe relative high threshold voltages V T independent of temperature. Here, we assume the origin of this behavior to lie in the heterostructures themselves, since our ALD process has previously shown to enable the deposition of hysteresis-free gate oxides that do not exhibit any significant shift in threshold voltages V T [30]. A recessetching through the MOD-doped layer together with further reduction of gate-oxide thickness might be a strategy to reduce threshold voltages.…”
Section: Resultsmentioning
confidence: 99%
“…FA high in alumina content is needed to fabricate the ceramic tile (Ahmad et al, 2021a). It is an electrical insulator used as a substrate for integrated circuits (Khosla et al, 2021). The percentages of Al 2 O 3 were 4.4% (OPC), 18.41% (FA), 17.91% (CBA, 45 µm), and 17.43% (CBA, 75 µm).…”
Section: Resultsmentioning
confidence: 99%
“…The FA is high in alumina content which is needed to fabricate the ceramic tile (Ahmad et al, 2021b). It is an electrical insulator used as a substrate for integrated circuits (Khosla et al, 2021).…”
Section: Discussionmentioning
confidence: 99%