“…[34] The curing effect for D it by Alnealing was also expected to a certain extent, as reductions for Al=SiO 2 =Si-based structures are reported in earlier works. [5,15,19,34,43] Furthermore, a similar reduction in D it of Al/Al 2 O 3 =Si MOS structures with sputtered Al films was recently reported by Khosla et al [44] The improvement could be explained by hydrogen species, which diffuse to the oxide-semiconductor interface and terminate the dangling bonds at the interface, as done for SiO 2 =Si interfaces. [5,32,34,43,45] Those hydrogen species form, when water, introduced to the system as traces of moisture, reacts with the Al during annealing.…”