2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) 2024
DOI: 10.1109/estc60143.2024.10712005
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High Rate and Selective Deep Reactive-Ion Etching Process for the Formation of High-Density Vertical Interconnects into Dielectric Build-Up Film

Ioannis Tsigaras,
Ioannis Alexiou,
Ewald Strolz
et al.
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