2006
DOI: 10.1016/j.jnoncrysol.2006.01.044
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High-rate deposition of nanocrystalline silicon using the expanding thermal plasma technique

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Cited by 9 publications
(3 citation statements)
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“…Previous work, however, has shown that the μc-Si:H material quality is poor [12][13][14][15]. In general, device-grade microcrystalline (and amorphous) silicon material is found close to the so-called amorphous-tomicrocrystalline transition regime, i.e.…”
Section: Introductionmentioning
confidence: 94%
“…Previous work, however, has shown that the μc-Si:H material quality is poor [12][13][14][15]. In general, device-grade microcrystalline (and amorphous) silicon material is found close to the so-called amorphous-tomicrocrystalline transition regime, i.e.…”
Section: Introductionmentioning
confidence: 94%
“…There are many different methods of producing nc-Si, such as radio frequency plasma enhanced chemical vapor deposition (CVD) [3], inductively coupled plasma CVD [4], hot wire CVD [5], expanding thermal plasma deposition [6], and others. However, there have been only a few studies where nc-Si was prepared from a-Si:H by solid-phase crystallization (SPC) [7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…[2][3][4][5][6] The ETP has proven to be a viable deposition technique for amorphous silicon (a-Si:H), silicon nitride, and silicon dioxide at very high growth rates (2-20 nm/s). [7][8][9] In addition, the setup is compatible with large-area deposition: for example, OTB-Solar/Roth&Rau (member of the Meyer Burger group) applies multiple ETP sources to achieve a uniform deposition over an area as large as $0.3 m 2 .…”
Section: Introductionmentioning
confidence: 99%