High-resolution electron microscopy of interfaces in fcc materials

Merkle, K. L.

doi:10.1016/0304-3991(91)90013-v

Cited by 84 publications

(30 citation statements)

References 64 publications

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“…and the close-packed planes. 26) It is generally known that the close-packed planes have very low energy in the metallic material. In case of the ATGB having different grain boundary plane from that of the STGB, the mixed structure consisting of the structural unit and the facetted coherent plane probably has lower energy than the grain boundary structure consisting of only the structural unit.…”

Section: High Angle Boundarymentioning

confidence: 99%

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

et al. 2008

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Grain boundary structures of ultrafine grained pure copper (Cu) fabricated by the accumulative roll bonding (ARB) have been studied. The atomic structures of grain boundaries in the ARB processed Cu (ARB-Cu) were observed by high resolution electron microscopy. In order to compare the grain boundaries in the ARB-Cu with equilibrium grain boundaries, the grain boundary energy and structure of symmetric tilt boundaries with h110i common axis in pure Cu were computed by molecular dynamics simulation (MD). The low angle boundaries in the ARBCu were basically described by conventional dislocation model and simultaneously there were some local structures having certainly high energy configurations. The grain boundaries with large misorientation in the ARB-Cu are basically described by the structural units predicted for the normal grain boundaries by MD. The present results indicate that the atomic structures of the boundaries in the Cu severely deformed by the ARB are rather similar to those of the equilibrium grain boundaries, except for the local distortions.

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Section: High Angle Boundarymentioning

confidence: 99%

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

et al. 2008

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“…Some studies have focused on atomic structure of metallic interfaces in solid-state joints to understand the basic behaviour of heterophase interface. [9][10][11][12][13][14] These studies have built various models to depict the interfaces morphology at as-bonded and annealed conditions. The development of interface, which has great influence on the fracture mechanism, is interpreted as the result of interdiffusion between Al and Cu atoms.…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

2007

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The aim of this study is to investigate the structure development and growth kinetics of the interfacial structure of cold roll bonded Al/Cu bimetal sheet. An interfacial structure is developed during the annealing process. The characteristics of the constituent phases at the interface of Al/Cu bimetal are studied by means of scanning electron microscope (SEM), X-ray diffraction (XRD) and transmission electron microscope (TEM). The results indicate that an obvious multi-layers interdiffusion structure is developed at the Al/Cu interface. The diffusion layer is consisted of four intermetallic compounds; Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The growth of these intermetallics during annealing can be achieved by the diffusion process. The activation energies of Al 2 Cu, AlCu + Al 3 Cu 4 , Al 4 Cu 9 and the total intermetallic layer are found to be 97.504, 107.46, 117.52 and 107.85 kJ/mol, respectively. These intermetallics generally possess higher hardness values than those of the corresponding base metals. AlCu and Al 3 Cu 4 exhibit much higher hardness than that of Al 2 Cu and Al 4 Cu 9 , which implies lower fracture toughness. The observation of crack propagation paths shows that fracture mainly occurs in the intermetallic compound layers of AlCu and Al 3 Cu 4 , which are located between Al 2 Cu and Al 4 Cu 9 .

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“…MgO, MnO, CdO, NiO) as grown by internal oxidation in fcc metals are predominantly present in octahedrally shaped precipitates bounded by parallel {111} planes of both metal and oxide [19][20][21][22][24][25][26][27][28][29][30]. In the oxide {111} corresponds to a polar interface.…”

Section: Discussionmentioning

confidence: 99%

“…Further, the O-terminated {111} interface was more stable than the Mg-terminated one. The mismatch between these fcc metals and NaCl structured oxides is usually quite large and closely spaced misfit dislocations are generated [19][20][21][24][25][26][27][28][29][30]. Consequently, the influence of misfit on the energy of facets cannot be deduced because it will be largely similar for all possible types of facet and hence does not result in observable deviations from the shape according to the Wulff energy construction in the absence of misfit.…”

Section: Discussionmentioning

confidence: 99%

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Influence of misfit and interfacial binding energy on the shape of the oxide precipitates in metals

Kooi

Hosson

2000

Acta Materialia

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Influence of misfit and interfacial binding energy on the shape of the oxide precipitates in metals; Interfaces between Mn3O4 precipitates and Pd studied with HRTEM Kooi, B.J.; de Hosson, J.T.M. Take-down policy If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim.Downloaded from the University of Groningen/UMCG research database (Pure): http://www.rug.nl/research/portal. For technical reasons the number of authors shown on this cover page is limited to 10 maximum. (1) the anisotropy in interface energy for oxide precipitates in a metal matrix is substantial due to the ionic nature of the oxide, giving well-defined shapes associated with the Wulff construction; (2) the influence of misfit energy on the precipitate shape as bounded by semi-coherent interfaces is important only if sufficient anisotropy in mismatch is present and if the matrix is sufficiently stiff; and (3) the stronger coupling strength due to electronic binding effects across the interface in Pd compared with Ag is responsible for formation of the dislocation network structures at larger misfit.

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High-resolution electron microscopy of interfaces in fcc materials

Cited by 84 publications

References 64 publications

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

Influence of misfit and interfacial binding energy on the shape of the oxide precipitates in metals

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