High-resolution, high-speed microscanner in single-crystalline silicon actuated by self-aligned dual-mode vertical electrostatic combdrive with capability for phased array operation

Lee, D.; Krishnamoorthy, Uma; Yu, Kun-Ming; Solgaard, Olav

doi:10.1109/sensor.2003.1215382

Cited by 11 publications

(4 citation statements)

References 11 publications

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“…If the two equilibrium equations in (2) and (3) were to be combined with the less-dominant critical stability condition in (5) or (9), then the coupled equations would be reduced to the case of b(θ) = 0. c) and (d) shows a side view of the scanner actuated by SVCs and AVCs, respectively.…”

Section: Pull-in Analysis Of a 2-dof Actuator With A Single Voltmentioning

confidence: 99%

“…Moreover, for a given α, f θ (α, b) monotonically decreases as b increases from 0 to 1. This implies that the use of the less-dominant critical stability conditions in (5) or (9) overestimates θ PI due to b = 0. This is clear from Fig.…”

Section: A φ Pull-in Modementioning

confidence: 99%

“…The key point is that both have movable and fixed combs that are defined by a single lithography step. Self-alignment of SVCs is achieved by creating masking features in the upper device layer and transferring them into the lower device layer on single silicon-on-insulator (SOI) [4] or double SOI wafers [5]- [7]. Additional masks are used to selectively remove remaining parts of the upper and lower device layer.…”

Section: Introductionmentioning

confidence: 99%

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Pull-In Analysis of Torsional Scanners Actuated by Electrostatic Vertical Combdrives

Lee

Solgaard

2008

J. Microelectromech. Syst.

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This paper presents pull-in analysis of torsional MEMS scanners actuated by electrostatic vertical combdrives with general comb gap arrangements and cross sections. The analysis is based on a 2-DOF actuator with a single voltage control. Three failure modes of the scanners are identified as in-plane twist, transversal motion, and out-of-plane twist. For each failure mode, analytical expressions of pull-in deflection are obtained by applying 2-D analytical capacitance models to the derived pull-in equations. From these, the dominant pull-in mechanism is shown to be in-plane twist for scanners with high-aspect-ratio torsional springs. The analytical calculations for both symmetric and asymmetric capacitances are shown to be in good agreement with simulation results. The optimum scanner design is achieved when the pull-in deflection matches the capacitance maximum angle. The condition can be expressed in terms of the ratio of the comb thickness to the comb gap, which is smaller than the typical aspect ratio of deep reactive ion etching. The optimum tradeoff between the maximum deflection angle and the number of movable combs is achieved by adjusting the overlap of the movable and fixed combs and the distance of the comb sets from the axis of the rotation.[ 2008-0103]Index Terms-Electrostatic actuation, in-plane twist, MEMS scanner, pull-in, 2-DOF, vertical combdrive.

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Section: Pull-in Analysis Of a 2-dof Actuator With A Single Voltmentioning

confidence: 99%

Section: A φ Pull-in Modementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Pull-In Analysis of Torsional Scanners Actuated by Electrostatic Vertical Combdrives

Lee

Solgaard

2008

J. Microelectromech. Syst.

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“…Electrostatic actuation can provide high bandwidth but often requires high voltages to achieve high displacements. For example, a high resolution and high speed micro-scanner has also been proposed using electrostatic actuation [10]. It requires an actuation voltage larger than 100 V, the typical drawback associated with electrostatic actuation as a result of optimizing device performance and minimizing power consumption [11].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and electromechanical characterization of silicon on insulator based electrostatic micro-scanners

Yan¹,

Apsel²,

Lal³

2005

Smart Mater. Struct.

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In this paper, a silicon on insulator based electrostatic micro-scanner with extremely low pull-in voltage and fast switching time is proposed. Two symmetric mirror plates are suspended by a cross suspension lever anchored on the substrate. A buried silicon dioxide (BOX) layer underneath the anchors separates the two actuation electrodes. The symmetric design can not only provide better balance of the mirror plates than cantilever design but also increase the dynamic range by scanning in two directions. The structural parameters of the micro-scanner are optimized for a combination of dynamic performance and actuation voltage according to finite element analysis (FEA). Squeeze film damping effects are addressed by a comparison of the theoretical analysis using FEA with experimental results. The testing results show that the pull-in voltage of the micro-scanner is as low as 2.7 V, making it compatible with off-the-shelf control logic circuits. The demonstrated tilt angle is approximately 0.5 • and may be increased by adjusting the thickness of the pre-specified BOX layer.

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Vertical Combdrive Actuator: Design and Fabrication for Micromirror Applications

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High-resolution, high-speed microscanner in single-crystalline silicon actuated by self-aligned dual-mode vertical electrostatic combdrive with capability for phased array operation

Cited by 11 publications

References 11 publications

Pull-In Analysis of Torsional Scanners Actuated by Electrostatic Vertical Combdrives

Pull-In Analysis of Torsional Scanners Actuated by Electrostatic Vertical Combdrives

Fabrication and electromechanical characterization of silicon on insulator based electrostatic micro-scanners

Vertical Combdrive Actuator: Design and Fabrication for Micromirror Applications

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