2014
DOI: 10.1088/0960-1317/24/6/065017
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High resolution micro ultrasonic machining for trimming 3D microstructures

Abstract: This paper reports on the evaluation of a high resolution micro ultrasonic machining (HR-μUSM) process suitable for post fabrication trimming of complex 3D microstructures made from fused silica. Unlike conventional USM, the HR-μUSM process aims for low machining rates, providing high resolution and high surface quality. The machining rate is reduced by keeping the micro-tool tip at a fixed distance from the workpiece and vibrating it at a small amplitude. The surface roughness is improved by an appropriate se… Show more

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Cited by 18 publications
(8 citation statements)
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“…With the development of high-precision technology, more and more high-strength, high-hardness, and hightemperature materials are needed. A number of material removal processes such as electrical discharge machining (EDM), [1][2][3] electrical ultrasonic machining (USM), 4,5 electrochemical machining (ECM), 6,7 and laser beam machining (LBM) [8][9][10] are developed for better ways of machining complex shapes in these highstrength materials.…”
Section: Introductionmentioning
confidence: 99%
“…With the development of high-precision technology, more and more high-strength, high-hardness, and hightemperature materials are needed. A number of material removal processes such as electrical discharge machining (EDM), [1][2][3] electrical ultrasonic machining (USM), 4,5 electrochemical machining (ECM), 6,7 and laser beam machining (LBM) [8][9][10] are developed for better ways of machining complex shapes in these highstrength materials.…”
Section: Introductionmentioning
confidence: 99%
“…Stainless steel tools have a lower tool wear ratio, i.e. the ratio of the tool height worn to the machined depth [2], [6]. For this letter, the µUSM tools were fabricated by micro electro discharge machining (µEDM) of a 500-µm thick stainless steel (SS#304) plate.…”
Section: A Tool Designmentioning
confidence: 99%
“…These ceramic materials are mostly transparent, insulating, and brittle and are not well suited for machining by laser, electrodischarge machining (EDM), or micromilling/drilling. The µUSM process is appropriate for micromachining both planar and 3-D structures of brittle materials without inducing stress or subsurface cracks [1]- [6]. Batch mode µUSM, which is performed with a patterned planar tool, facilitates die-scale or wafer-scale transfer of complicated lithographical patterns onto ceramic substrates with high throughput [2].…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, a directional lapping technique can decrease the frequency split well but it is complicated to determine the position of the rigid-axis [ 6 ]. Although adding mass has little effect on the quality factor, it requires high-precision equipment and is high-cost, which creates many difficulties for frequency tuning [ 7 , 8 , 9 ].…”
Section: Introductionmentioning
confidence: 99%