“…Several different applications have been reported, such as jewelry, 6 laser diode mounting onto heat sinks, [7][8][9] micro-electromechanical systems (MEMS) bonding, 10 flip-chip mounting, 3,11 and wafer-scale bonding. [12][13][14] Diffusion and reaction phenomena in the binary Au-Sn system have been deeply investigated in bulk, [15][16][17][18][19][20][21][22][23] in thin-film, [24][25][26][27][28][29][30][31][32][33][34][35][36] and even in almost 1-D 37 systems. Even if the diffusion and reaction phenomena are thought nowadays to be partially understood for the Au-Sn binary system, one crucial concern for the design of any solder system is the interaction with neighboring metallizations, as outlined in the recent review for several lead-free solders by Laurila et al 38 Pt is widely established as a neighboring metallization to Au-Sn solder, as emphasized by the past 15 years of literature.…”