2007
DOI: 10.1063/1.2800813
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High responsivity of GaN p-i-n photodiode by using low-temperature interlayer

Abstract: Gallium nitride p-i-n ultraviolet photodiodes with low-temperature (LT)-GaN interlayer have been fabricated. It was found that the dark current of photodiode with LT-GaN interlayer is as small as 143pA at 5V reverse bias. It was also found that the responsivity of the photodiode with LT-GaN interlayer can be enhanced at a small electric field (∼0.4MV∕cm) due to the carrier multiplication effect. The UV photocurrent gain of 13 and large ionization coefficient (α=3.1×105cm−1) were also observed in the detector w… Show more

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Cited by 33 publications
(11 citation statements)
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“…III-V nitride semiconductors have attracted much attention on light emitting devices [1], photodetector [2][3][4][5], and high power and high frequency transistors. The bandgap energy of 0.6~0.8 eV was observed from Molecular beam epitaxy (MBE) and Metal organic chemical vapor deposition (MOCVD) grown InN samples by several research groups [6][7][8].…”
mentioning
confidence: 99%
“…III-V nitride semiconductors have attracted much attention on light emitting devices [1], photodetector [2][3][4][5], and high power and high frequency transistors. The bandgap energy of 0.6~0.8 eV was observed from Molecular beam epitaxy (MBE) and Metal organic chemical vapor deposition (MOCVD) grown InN samples by several research groups [6][7][8].…”
mentioning
confidence: 99%
“…However, the crystalline quality of the bottom n-GaN and i-GaN layers cannot be improved by an LT-AlN interlayer. On the other hand, the GaN p-i-n PDs with an LT-GaN interlayer showed a dark current of 147 nA at the reverse bias of 40 V [15], which is larger than the dark current of detectors with an LT-AlN interlayer. Thus, comparing the results of these two structures, the less dislocations effect of the LT interlayer should not be responsible for dark current reducing in our GaN p-i-n detectors.…”
mentioning
confidence: 85%
“…High reverse bias is needed to initiate the avalanche process in these materials. The evacuation rate of charge carriers from the depletion region is also slow [1,[4][5][6][7][8][9]. The excess noise factor (F) is reported to be in the range 4-5 for III-V materials and 2-3 for Si.…”
Section: Introductionmentioning
confidence: 99%