High-sensitivity receiving sub-array module with HTS filters for an active phased array antenna

Kumamoto, Takuya; Kayano, Hiroyuki; Shiokawa, Noritsugu; Nakayama, Keiichi I.; Kawaguchi, Takeshi; Shinonaga, Mitsuyoshi

doi:10.1109/array.2013.6731852

Cited by 6 publications

(3 citation statements)

References 6 publications

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“…Table I shows the performance comparison of the proposed X-band phased array antenna in similar works in literature. The proposed X-band phased array antenna is integrated with 3D T/R module which is more compact than those in [31,32,33]. The proposed connection mode of the X-band phased array antenna adopts SMP which has better insertion loss than SMA and RF cable in [31,32,33].…”

Section: Thermal Managementmentioning

confidence: 99%

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Integrated design of X-band phased array antenna with LTCC 3D T/R module

Tan

Sun

et al. 2020

IEICE Electron. Express

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In this paper, a novel design scheme of X-band phased array antenna is introduced. The antenna array is mainly composed of the 3D T/R module, which is based on LTCC technology, and the slotted waveguide antenna. The whole system adopts the vertical interconnected threedimensional multi-layer technology for the spaceborne synthetic aperture radar (SAR) system. 3D T/R module greatly improves the integration of the system by assembling different multifunctional chips into a complete multi-layer LTCC substrate. The slotted waveguide antenna is connected vertically with the T/R module, the power divider, etc, implementing the integrated design. The test results of the antenna system show that the phased array antenna has a good performance in terms of gain, radiating patterns and so on, which provides a new idea for the integrated design of the phased array antenna.

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Section: Thermal Managementmentioning

confidence: 99%

“…SMP is also very convenient for application. Thermal management of [31,32] adopts cooling plate and [33] adopts stirling coller. The heat pipe used in this paper realizes low cost and convenience.…”

Section: Thermal Managementmentioning

confidence: 99%

Integrated design of X-band phased array antenna with LTCC 3D T/R module

Tan

Sun

et al. 2020

IEICE Electron. Express

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“…Because APAAs need to fulfill the requirements of both thermal and electromagnetic performance, any unreasonable allocation of thermal design indicators may lead to redesign, reproduction, and retesting of the antenna components, sub-systems, and even the entire system, thus prolonging the development cycle and increasing the development cost. In addition, new materials and devices have been gradually applied, such as high-temperature superconducting (HTS) filters [13][14][15], for realizing high sensitivity and reducing the noise temperature. Application of these devices can solve some thermal problems but their scope of application is limited.…”

Section: Introductionmentioning

confidence: 99%

Effect of Temperature on Electromagnetic Performance of Active Phased Array Antenna

Wang

Lian

et al. 2020

Electronics

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Active phased array antennas (APAAs) can suffer from the effects of harsh thermal environments, which are caused by the large quantity of power generated by densely packed T/R modules and external thermal impacts. The situation may be worse in the case of limited room and severe thermal loads, due to heat radiation and a low temperature sink. The temperature field of the antenna can be changed. Since large numbers of temperature-sensitive electronic components exist in T/R modules, excitation current output can be significantly affected and the electromagnetic performance of APAAs can be seriously degraded. However, due to a lack of quantitative analysis, it is difficult to directly estimate the effect of temperature on the electromagnetic performance of APAAs. Therefore, this study investigated the electromagnetic performance of APAAs as affected by two key factors—the uniformly distributed temperature field and the temperature gradient field—based on different antenna shapes and sizes, to provide theoretical guidance for their thermal design.

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