2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A 2015
DOI: 10.1109/imws-amp.2015.7324964
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High-speed and low-power OOK CMOS transmitter and receiver for wireless chip-to-chip communication

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Cited by 8 publications
(3 citation statements)
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“…The mm-wave band is now considered an alternative frequency resource that can meet the increased demand. Several on-off keying (OOK) transceivers have been reported at mm-wave bands, especially the V-band [3]- [7]. The OOK architecture is appropriate for massive short-distance communications between chips, boards, and devices due to its simplicity, low DC consumption, and small chip size.…”
Section: Introductionmentioning
confidence: 99%
“…The mm-wave band is now considered an alternative frequency resource that can meet the increased demand. Several on-off keying (OOK) transceivers have been reported at mm-wave bands, especially the V-band [3]- [7]. The OOK architecture is appropriate for massive short-distance communications between chips, boards, and devices due to its simplicity, low DC consumption, and small chip size.…”
Section: Introductionmentioning
confidence: 99%
“…During the beginning of the 21 th century, the situation changed dramatically thanks to the aggressive transistor scaling trend driven by the mobile industry which allowed to conquer the SHF band-frequency, implying more bandwidth and the chance for the first time in history of improving C without increasing the complexity of the modulations. Impulse-Radio/Ultra-Wide-Band (IR/UWB) TRxs have been explored in [10][29][30] [37], usually their architecture is simple and energy efficient. IR/UWB Rxs can be classified into coherent (complex but efficient) and noncoherent (simple but not that efficient) where an oscillator may be spared, and the latter case can be divided into autocorrelation and energy-detection (mixer not needed) types.…”
Section: Impulse-radio Front-ends At Low Terahertz Frequenciesmentioning
confidence: 99%
“…The CAS consists of cascading a common-source GFET1 and a common-gate GFET2 as shown in Figure 4.16, where W1/2 are the channel widths, L1/2 are the gated channel lengths, Ls/m/d are the ungated channel-lengths, and tOX1/2 are the gate-dielectric thicknesses. GFET2 is acting as a voltage follower, so its drain voltage is following V bias instead of V out , this node decoupling improves the final current saturation of the circuit: This can also be interpreted as a GFET device with a much-decreased output conductance: 36) and similar transconductance: 37) deriving into a substantial increase in intrinsic gain: 38) should be the square of the GFET intrinsic-gain [128]:…”
Section: Cas Simulation Based On Cvd Gfets Fabricated With Silica Top...mentioning
confidence: 99%