High Speed Pull Test Characterization of BGA solder joints

Valota, A.T.; Losavio, A.; Renard, Loic; Vicenzo, Antonello

doi:10.1109/esime.2006.1644005

Cited by 17 publications

(8 citation statements)

References 8 publications

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“…Unfortunately, the complexity of the setup limits the test to laboratory use. Ball impact shear tests using a simpler test setup that employs a striker attached with a load cell were reported by Newman [43] of Sun Microsystems, Wong et al [44,45] of IME, Yeh et al [46,47] and Lai et al [48] of ASE, Valota et al [49] of ST Microelectronics, Song et al [50][51][52] of HKUST, and Zhao et al [53] of Philips. The displacement of the striker was measured using a linear variable differential transformer (LVDT).…”

Section: Review Of Test Methodsmentioning

confidence: 94%

A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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Section: Review Of Test Methodsmentioning

confidence: 94%

A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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“…As the inter-metallic layers are brittle a microstructural mismatch exists between the solder and pad metallization. It has been reported in literature that the interface between pad metallization and intermetallic layer is very susceptible to failure [55]. Ball shear test gives a great opportunity to find about the structure before the packages are mounted on board.…”

Section: Resultsmentioning

confidence: 99%

Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability

Lakhkar

Viswanadham

Agonafer

2009

Volume 5: Electronics and Photonics

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Ball shear testing is typically conducted in Wafer level chip scale package (WLCSP) fabrication to estimate the strength of the solder ball attachment. Generally, the solder ball shear strength is dependent on the solder ball size, pad size, solder/pad interface treatment, reflow temperature and time. Solder ball strength is also a function of ram speed and height at which the ball is sheared with respect to the wafer. Recent investigations suggest that ball shear test is being used as an indicator for board level reliability of assemblies. In current market lead time for launching a new product is very short. Unfortunately, it takes several weeks to qualify a new product by board level qualification process. If there is a methodology through which one can predict the board level performance by extrapolating the wafer level test, it will save great amount of resources in testing and millions of dollars worth of testing time. In the first part of this study, we conducted a wafer level ball shear test. A DOE was created for varying wafer level structural parameters like solder ball size and type. Ball shear tests and Accelerated thermal cycling have similar failure signatures of compression on inner side and tension on outer side. Thus, for specific cases there is a possibility of correlating the two failure methodologies based on their failure signatures. Strain rate for ball shear test was determined based on shear speed and solder pad diameter. Strain rate for accelerated thermal cycling was determined based on difference in CTE between board and package. In this paper, results from ball shear test and accelerated thermal cycling are compared to find correlations for specific cases. The correlations derived from this study are statistical and empirical.

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“…High shear rates have been shown to increase brittle fracture in solder ball shear tests and these results correlate better with board-level drop tests of solder joint reliability. 3,4 For quantitative comparison between samples, peak ball shear force (F shear ), displacement at peak force (Dx), and energy to shear (E shear ) were calculated from individual ball shear curves as illustrated in Fig. 3.…”

Section: Methodsmentioning

confidence: 99%

“…1,2 The demand for portability also raises the importance of shock loading performance on solder joints. Many studies have been done on Pb-free solders to characterize board-and component-level performance as a means of evaluating solder joint integrity under mechanical shock, [3][4][5][6] however little data is available on shock performance of laser reflowed solder joints.…”

Section: Introductionmentioning

confidence: 99%

Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting

Wagner

Ladwig

Riemer

et al. 2009

Journal of Elec Materi

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The majority of research on Pb-free solders has been done with reflow times sufficient to allow significant intermetallic growth at the liquid solder/pad interface. With the need for small, fine-pitched solder joints and to avoid damage to heat-sensitive read/write sensors, the hard disk drive industry predominantly uses solder jet bonding for electrical connections of the heads. This technique does not use flux and has solidification times on the order of a millisecond, four orders of magnitude smaller than that of conventional solder technology. Therefore, the intermetallic formation is highly nonequilibrium and is localized near the pad interface. Surface finish thicknesses and composition have a significant influence on intermetallic growth and composition of solder joints. The intermetallic microstructure, along with voids, can significantly impact joint reliability. In this paper, results of wettability and mechanical solder ball shear measurements on as-plated and aged samples are reported and correlated with microstructure and growth of intermetallic compounds (IMCs) at the solder/pad interface. A wide range of Au-Sn IMCs are found at the pad interface, and Au-embrittlement effects are not found until Au exceeds 7 wt.%.

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High Speed Pull Test Characterization of BGA solder joints

Cited by 17 publications

References 8 publications

A review of board level solder joints for mobile applications

A review of board level solder joints for mobile applications

Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability

Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting

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