High-speed simulation of PCB emission and immunity with frequency-domain IC/LSI source models

Abstract

Some recent results from research conducted in the EMC group at Okayama Universiry are reviewed A scheme for power-bus modeling with an analytical method is introduced. A linear macro-model for ICdLSIs. called the LECCS model, has been developed for EM and EMS simulation. This model has a very simple structure and is suficiently accurate. Combining the LECCS model with analytical simulation techniques for power-bus resonance simulation provides a method for high-speed E M simulation and decoupling evaluation related to PCB and LSI design. A usefir explanation of the common-mode excitation mechanism, which utilizes the imbalancefactor of a transmission line, is also presented. Some of the results were investigated by implementingprototypes of a high-speed EM7 simulator, HISES.

Dedicated computational models for the electromagnetic emissions of integrated circuits

“…The first version (the LECCS-core model) was proposed to evaluate the radio frequency noise current on a power pin of a core logic circuit [9] and was then extended to a model for devices that have output drivers (the LECCS-I/O model) [10].…”

“…The LECCS model has the following features [9]. (i) All the model parameters can be determined by measurements.…”

Electromagnetic Compatibility of Integrated Circuits

“…The model was originally proposed to evaluate the RF noise current on a power pin of a core logic circuit (LECCS-core) (Takahata, 1999;Wada, 2000;Fukumoto, 2001). At Okayama University, the LECCScore model was combined with a swift electromagnetic field simulator for the power-bus resonance simulation of a PCB, which was implemented as HISES4 software, and the decoupling characteristics were evaluated with good accuracy ( Wada, 2003;Koga, 2004;). Each model consists of linear equivalent circuits (LEC) with R, L, and C, and internal equivalent current sources (CS).…”

Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz

“…The input/output buffer information specification [4] was developed in the early 1990s to describe the electrical performance of the I/O structures of an IC. However, this model does not take into account the main source of IC parasitic emissions, i.e., the Manuscript On the other hand, the "linear equivalent circuit and current source" (LECCS) model [5], [6] is an electrical model originally proposed for the core circuits of ICs and large-scale integration's immunity model. The LECCS model is able to predict the conducted emissions and analyze the immunity of the ICs up to 1 GHz.…”