2001
DOI: 10.1063/1.1412592
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High-speed visible-blind GaN-based indium–tin–oxide Schottky photodiodes

Abstract: We have fabricated GaN-based high-speed ultraviolet Schottky photodiodes using indium-tinoxide ͑ITO͒ Schottky contacts. Before device fabrication, the optical transparency of thin ITO films in the visible-blind spectrum was characterized via transmission and reflection measurements. The devices were fabricated on nϪ/nϩ GaN epitaxial layers using a microwave compatible fabrication process. Our ITO Schottky photodiode samples exhibited a maximum quantum efficiency of 47% around 325 nm. Time-based pulse-response … Show more

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Cited by 63 publications
(35 citation statements)
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“…To improve the p-ohmic contact quality, a 30-nm-thick p-type GaN cap layer was grown on top of p-Al Ga N layer. A five-step microwave compatible semiconductor fabrication process was utilized to complete the device fabrication [15]. In the first two steps, ohmic contacts were formed.…”
mentioning
confidence: 99%
“…To improve the p-ohmic contact quality, a 30-nm-thick p-type GaN cap layer was grown on top of p-Al Ga N layer. A five-step microwave compatible semiconductor fabrication process was utilized to complete the device fabrication [15]. In the first two steps, ohmic contacts were formed.…”
mentioning
confidence: 99%
“…The UV RCE detector consisted of a thin 70-nm GaN absorption layer, Al Ga N ohmic contact layer and a 20 pair bottom AIN-Al Ga N Bragg mirror centered at 350 nm. The details of the epitaxial structures can be found elsewhere [16]- [18].…”
Section: B Design Of Photodiode Structuresmentioning
confidence: 99%
“…Recently, we have demonstrated ITO-Schottky photodiodes on AlGaAs-GaAs [15] and AlGaN-GaN [16]- [18] material systems for near-IR and UV detection, respectively. In this paper, we review our ITO-Schottky research and present the measurement results of our newly fabricated IR m RCE ITO-Schottky photodiodes on InAlGaAs-InP and InGaAsP-InP heterostructures.…”
mentioning
confidence: 99%
“…However, deposition of GaN layers with a low thermal budget is still a major challenge. Traditional methods for the deposition of GaN layers are metal organic chemical vapor deposition, [8][9][10] molecular beam epitaxy, 11,12 and hydride vapor phase epitaxy. 13 However, integration of GaN devices on flexible substrates is hampered by these high temperature growth techniques.…”
Section: Introductionmentioning
confidence: 99%