High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS

“…Furthermore, the anode current collectors of Li-ion batteries are electrodeposited Cu foils. 13,14 In addition, metal coatings have been used as electrocatalysts for energy conversion and storage such as water splitting, fuel cells, and CO 2 reduction. [15][16][17][18][19] Metal coatings can be fabricated using several methods, including physical vapor deposition (PVD), eletrodeposition (or electroplating), electroless deposition, chemical vapor deposition (CVD) and atomic layer deposition (ALD).…”

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confidence: 99%

Electrodeposition of Nano-Twinned Cu and their Applications in Electronics

Park¹,

Eom²,

Kim³

et al. 2022

J. Electrochem. Soc.

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Twin boundaries are planar defects between two domains exhibiting mirror symmetry. Nano-twinned metallic materials contain numerous twin boundaries in parent grains exhibiting submicrometer twin spacing. Owing to their unique mechanical and electrical properties, nano-twinned metals have been studied extensively. Although the mechanical strength of the metal can be drastically increased by shrinking grains, nanocrystalline metals lose their ductility (i.e., the strength–ductility tradeoff), and their electrical conductivity is considerably lowered owing to electron scattering at dense grain boundaries. However, nano-twinned metallic materials can overcome these limitations and exhibit excellent strength, ductility, and electrical conductivity. In this paper, the structure and properties of nano-twinned Cu films are reviewed, and direct current and pulse electrodeposition for forming twin boundaries in Cu films and controlling the twin structure and thickness are summarized. Furthermore, the applications of nano-twinned Cu materials for fabricating electronics are presented.

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“…Electrolytic copper foils with thicknesses of a few microns have been widely used as an electrical conductor within various electronic devices, such as printed circuit boards (PCB), and semiconductor packages. 1 This material is usually prepared by Cu electrodeposition techniques on a rotating drum, [2][3][4] followed by various surface treatments, such as nodulation, chromate coating, and silane coupling. 5,6 The primary purpose of these treatments is to form a robust physical/chemical bonding with dielectric polymers, required to improve the reliability of electronic devices.…”

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confidence: 99%

Electrolytic Chromate Films Prepared via Pulse Electrodeposition as a Cu-Epoxy Adhesion Promoter

Kwon

Park

Lee

et al. 2020

J. Electrochem. Soc.

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Chromate films with nanometer-scale thicknesses typically act as secondary adhesive layers between Cu and a polymer film to produce a copper clad laminate (CCL); chromate films provide surface hydroxyl (-OH) that ensures strong binding with the silane coupling agent (primary adhesion promoter). To improve the adhesive strength between Cu and epoxy substrates, in this study, Cr(OH) 3 films with high surface coverages were deposited via the pulse electrodeposition technique. In comparison with conventional direct current modes, pulse plating enables the development of high densities of Cr(OH) 3 nuclei, resulting in a uniform film growth. Thus, the use of pulse plating leads to good coverage of Cr(OH) 3 on a Cu surface, and in turn, a higher peel strength with epoxy, and excellent corrosion protection. These observations indicate that chromate films generated via pulse plating may be a good option for post-treatment of Cu foils to ensure their reliable application for 5 G electronic devices.

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High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS

Cited by 16 publications

References 44 publications

Mechanics-based design of lithium-ion batteries: a perspective

Mechanics-based design of lithium-ion batteries: a perspective

Electrodeposition of Nano-Twinned Cu and their Applications in Electronics

Electrolytic Chromate Films Prepared via Pulse Electrodeposition as a Cu-Epoxy Adhesion Promoter

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