High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

Abstract

Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines as a coating agent for enhancing the pressureless sintering performance. This work systematically introduced the Ag nanoparticle modification process, Ag paste preparation, and sintering process and compared the changes in the sintering performance of Ag nanoparticles after modification with four different alkyl chain lengths of amines. The study showed that the sintered films of Ag nanoparticle pastes modified with n-octylamine (NOA) can achieve the lowest resistivity of the sintered film and the highest shear strength of the bonded joints. The resistivity of the sintered Ag film is affected by the grain size and microscopic morphology, and the strength of the bonded joints is also related to the sintering density and the amount of organic residues. The thermal behavior of the Ag particles coated with different amines is measured by thermal analysis. Finally, the mechanism of NOA-modified Ag nanoparticles to improve the sintering performance is proposed. This study can provide effective data and theoretical support for the further promotion and application of nano-Ag pressureless sintering.

Ultradeep Removal of Acetaldehyde from Ethanol through Catalytic Hydrogenation with Highly Dispersed Ag Nanoparticles Supported on Phenyl-Modified SiO2

“…The electronic binding energies of Ag 0 3d 5/2 for Ag/SiO 2 and Ag/Ph-SiO 2 were 368.1 and 368.4 eV, respectively, which confirmed that the precursor of silver salt had been totally converted to the form of metallic silver during the preparation process. , This is also consistent with the XRD characterization results. In addition, compared with that of Ag/SiO 2 , the peaks of Ag 0 3d 5/2 and Ag 0 3d 3/2 shifted to a higher binding energy for Ag/Ph-SiO 2 , indicating that the electron density of Ag NPs increased, which should be caused by the stronger interaction between Ag NPs and the surface of Ag/Ph-SiO 2 . The more negative metal could show a stronger catalytic hydrogenation ability, which is a potentially beneficial factor for the following catalytic hydrogenation application. − …”

“…In addition, compared with that of Ag/SiO 2 , the peaks of Ag 0 3d 5/2 and Ag 0 3d 3/2 shifted to a higher binding energy for Ag/Ph-SiO 2 , indicating that the electron density of Ag NPs increased, which should be caused by the stronger interaction between Ag NPs and the surface of Ag/Ph-SiO 2 . 41 The more negative metal could show a stronger catalytic hydrogenation ability, which is a potentially beneficial factor for the following catalytic hydrogenation application. 42−44 3.2.…”

Enhancing Semiconductor Package Reliability through Mechanical Property Optimization of Pressureless Sintering Die Attach Adhesives

“…Currently, solder for new automotive power modules is made of tin-based compounds [3,4]. Because of its low melting temperature and degradation, tinbased solder is not suitable for supporting temperatures higher than 150 °C [5]. A replacement of such technology is urgently required to improve performance and reliability over the current solder process.…”

Morphological Design and Synthesis of Nanoparticles

“…The research underscores the impact of nanoparticle proximity on optical rectification coefficients under various external field conditions, providing insights into the design and optimization of photonic materials and devices that exploit the unique electromagnetic interactions between nanoparticles and molecular systems. The experimental work of Shen et al [ 6 ] introduces a novel approach to enhancing the sintering performance of silver nanoparticle pastes through surface modification with organic amines. This method significantly improves the electrical conductivity and mechanical strength of sintered joints, providing a promising solution for high-performance electronic packaging applications.…”