High Surface Planarity Die Bonding of Large Optical Chips

Abstract

Analog Spatial Light Modulators (ASLM) are highly specialised MOEMS devices, which, in our case, are used as programmable mask in extremely high-resolution DUV mask writing systems. Resolution, precision, contrast and optical uniformity of the mask patterns produced by this new type of mask writers depend on the local and global planarity as well as on the optical contrast of the ASLM devices [1].