High-temperature adaptive through-silicon via with pyrolyzed carbon via-sealing plates for packaging 3D carbon nanostructure-based devices fabricated using C-MEMS

Kwak, Jong-Hyun; Cho, Wootaek; Kim, Beomsang; Kim, Taejung; Shin, Heungjoo

doi:10.1016/j.carbon.2023.118534

Carbon

2024

DOI: 10.1016/j.carbon.2023.118534

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High-temperature adaptive through-silicon via with pyrolyzed carbon via-sealing plates for packaging 3D carbon nanostructure-based devices fabricated using C-MEMS

Jong-Hyun Kwak,

Wootaek Cho,

Beomsang Kim

et al.

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A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration

Xia,

Zhang,

et al. 2024

Adv Eng Mater

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Through‐silicon via (TSV) technology realizes high‐density interconnections within and between different dies (chips) by vertically drilling holes in silicon and filling them with various conductive materials. It is an effective way to achieve miniaturization, lightweight, and multi‐functionality in post‐Moore microelectronics. In this review, the process optimization in TSV preparation, various filling techniques, and different filler materials are comprehensively summarized and discussed. It also delves into the characterization and reliability analysis of TSV performance under multi‐physical fields of mechanical, thermal, and electrical. Moreover, the review explores the challenges and solutions for TSVs in regards of integration/packaging and cost aspects. This review can be used to understand the latest research progresses and applications of TSVs, and provide reference and guidance for future research and applications for advanced TSV technology.

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A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration

Xia,

Zhang,

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

show abstract

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High-temperature adaptive through-silicon via with pyrolyzed carbon via-sealing plates for packaging 3D carbon nanostructure-based devices fabricated using C-MEMS

Cited by 1 publication

References 53 publications

A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration

A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration

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