High temperature ageing of microelectronics assemblies with SAC solder joints

Sabbah, Wissam; Bondue, Pierre; Aviñó-Salvadó, Oriol; Buttay, Cyril; Frémont, Hélène; Guédon-Gracia, Alexandrine; Morel, Hervé

doi:10.1016/j.microrel.2017.06.065

Cited by 9 publications

(4 citation statements)

References 9 publications

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“…As shown in Figure 4a,b, the microstructure surface of the Sn90Sb10 filaments' solder joints is smoother than that of the SAC0307 filaments' solder joints. More voids and cracks are present in the solder joints of the SAC0307 filaments, and as evident in Figure 4a, cracks are most likely to occur where voids are [19][20][21]. Figure 5 shows the shearing force for FC-LED filament solder joints obtained with SAC0307 and Sn90Sb10 solders.…”

Section: Methodsmentioning

confidence: 99%

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

et al. 2019

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This article researches the effect of Sn-based solder alloys on flip-chip light-emitting diode LED (FC-LED) filament properties. SEM images, shearing force, steady-state voltage, blue light luminous flux, and junction temperature were examined to demonstrate the difference between two types of FC-LED filaments welded with two solders. The microstructure surface of Sn90Sb10 filament solder joints was smoother and had fewer voids and cracks compared with that of SAC0307 filament solder joints, which indicates that the Sn90Sb10 filaments had a higher shearing force than the SAC0307 filaments; moreover, the average shearing force was beyond 200 gf (standard shearing force). The steady-state voltage and junction temperature of the Sn90Sb10 solder-welded FC-LED filament were lower, and the Sn90Sb10 filament had a relatively higher blue light luminous flux. If high reliability of the solder joints and better photoelectric properties of the filaments are required, this Sn90Sb10 solder is the best bonding material for FC-LED filament welding.

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Section: Methodsmentioning

confidence: 99%

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

et al. 2019

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“…At system level, an appropriate package for these devices is required to maximize the power converter performances. The main weak points of the standard packaging and interconnection technologies are the wire bondings on the topside contacts and the solder materials on the backside contact [2][3][4]. Offering an alternative solution for one or both, the top and backside contacts, is motivating recent developments and researches in power electronics packaging in order to improve the electrical, thermal, thermomechanical and EMC performances of the power modules.…”

Section: Introductionmentioning

confidence: 99%

Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

Vladimirova

Widiez

Letowski

et al. 2018

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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This paper presents a wafer-level pre-packaging technology for power devices. The concept consists in the implementation of a thick 3D patterned copper leadframe ensuring the interconnections of the power devices among them or with the other components of the converter. The metallic leadframe is bonded between two wafers of semiconductor devices enabling the 3D power module integration by the 3D stacking of one or multiple switching cells. Specific technology developments are introduced, practical realizations of the concept are presented and the electrical characterizations of the first prototypes are discussed.

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“…These composite materials withstand extreme working conditions during their lifetime, like high temperatures [6], moisture [7] and chemicals that degrade the integrity of the assembly, such as oxygen, hydrogen and others [8]. These conditions trigger aging reactions that permanently modify the properties of the materials, leading to the deterioration of their properties and lifetime reduction.…”

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confidence: 99%

Viscoelastic behavior of filled silicone elastomers and influence of aging in inert and hermetic environment

Torrado

Constantinescu

Johlitz

et al. 2022

Continuum Mech. Thermodyn.

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This article presents a series of experimental investigations on the viscoelastic behavior of silicafilled and silver-filled silicone rubber on the unaged and aged states. The study of specific aging conditions relative to the electronics industry is proposed in this work, namely aging in a hermetic, initially inert atmosphere, at high temperatures. Viscoelastic properties of the materials are measured through DMA tests. Strain sweep tests are carried for the characterization of unaged materials, and frequency sweeps at ambient temperature are performed to characterize the aging-dependent behavior. As a result of the experimental studies, an aging-dependent generalized Maxwell model is proposed in an attempt to describe the evolution in the behavior of silicones due to aging. Keywords Silicone rubber • Aging • Viscoelastic behavior • Material modeling 1 IntroductionSilicone rubber materials are long-established in the electronics industry. Silica-reinforced silicones, for instance, are widely used for both the assembly and the encapsulation of electronic devices, thanks to their interesting properties in terms of sealing and thermal stability [1]. Also, the last decades have seen the rise of electrically conductive silicone rubbers that, thanks to the addition of metallic fillers in high proportion (such as silver, copper and aluminum), are able to conduct electric signals. Electrically conductive adhesives are proved to have good mechanical strength and excellent electrical conductivity [2,3]. Therefore, they are adequate replacements for conventional assembly techniques in the electronics industry, as they are simpler and safer to implement than procedures like brazing and soldering [4,5].

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High temperature ageing of microelectronics assemblies with SAC solder joints

Cited by 9 publications

References 9 publications

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

Effect of Different Bonding Materials on Flip-Chip LED Filament Properties

Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

Viscoelastic behavior of filled silicone elastomers and influence of aging in inert and hermetic environment

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