High Temperature Die Interconnection Approaches

Alshatnawi, Firas; Alhendi, Mohammed; Al-Haidari, Riadh; Sivasubramony, Rajesh Sharma; Abbara, El Mehdi; Somarathna, K Udara; Poliks, Mark D.; Børgesen, Peter; Shaddock, David; Stoffel, Nancy; Hoel, Cathleen A.

doi:10.1109/ectc51906.2022.00245

Cited by 11 publications

(2 citation statements)

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“…[ 14–16 ] Materials such as platinum, nickel, and gold are of interest for HTE applications because of their superior oxidation resistance and good performance and stability at high temperatures. [ 17–20 ]…”

Section: Introductionmentioning

confidence: 99%

“…[14][15][16] Materials such as platinum, nickel, and gold are of interest for HTE applications because of their superior oxidation resistance and good performance and stability at high temperatures. [17][18][19][20] Due to recent developments in printable metallic, [21] insulating, [22] semiconducting materials, [22,23] and mature printing processes, printing is now a feasible manufacturing technology for creating electronics. [24][25][26][27][28] Printed electronics has expanded to include electrical devices, sensors, [29,30] and circuits, [31] with applications in energy, health, and consumer electronics.…”

Section: Introductionmentioning

confidence: 99%

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Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

et al. 2023

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There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high‐temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 °C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 °C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 °C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.

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Section: Introductionmentioning

confidence: 99%