High-temperature endurable encapsulation material

Chidambaram, Vivek; Yeung, Ho Beng; Sing, Chan Yuen; Woo, Daniel Rhee Min

doi:10.1109/eptc.2012.6507052

Cited by 8 publications

(5 citation statements)

References 3 publications

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“…Other polymers, like benzocyclobutene BCB are candidates and are stable at the temperature above 300 °C, but the major issue encountered for thick films is the void generation during the curing process [108].…”

Section: Encapsulationmentioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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Abstract-Silicon-Carbide (SiC) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging becomes a limiting factor in fully realizing the benefits offered by SiC power devices, and thus, improved and advanced packaging structures are required to bridge the gap between SiC devices and their applications. This paper provides a review of the state-of-art advanced module packaging technologies for SiC devices with the focuses on module layout, packaging material system, and module integration trend, and links these packaging advancements to their impacts on the SiC device performances. Through this review, the paper discusses main challenges and potential solutions for SiC modules, which is critical for future SiC applications.Index Terms-Packaging material system, power module integration, SiC advanced packaging.

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Section: Encapsulationmentioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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“…Table IV shows the various potential encapsulation materials for high-temperature applications of SiC devices. Care should be taken while choosing the encapsulation materials as they could show decline in shear strength [92], degradation upon cycling [93] and generation of voids [59]. Epoxy Resin [93] Operating temperature -200 Poly (dimethyl diphenyl) siloxane [94] Maximum operating temperature -265 Silica-filled poly (dimethyl) siloxane [94] Maximum operating temperature -275…”

Section: E Encapsulation Materialsmentioning

confidence: 99%

“…Phenolics resin [95] Operating range --250 to 260 Silicones [96] Continuous maximum operating temperature -260 Poxy-phenolic alloy [96] Continuous and short term operation -177 and 371 Parylene F [97], [98] Operating temperature -200 Polyamide [97] Operating temperature (Tg >260 • C) ->200 Parylene HT [98] Maximum operating temperature -600 Benzocyclobutene [99] Tg >350 • C Cyanate Ester [92] Application temperature -260 to 280…”

Section: E Encapsulation Materialsmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technologies for the over-current performance of SiC power modules in power electronics converters. It presents the limitations produced at the power module level by packaging materials which include semiconductor chips, substrates, metallization, bonding techniques, die attach, and encapsulation materials. Specifically, technologies for over-current related temperatures in excess of 200 • C are discussed. The paper also discusses potential technologies which have been proven or may be potential candidates for improving the safe operating area. The discussed technologies are use of phase change materials below the semiconductor chip, Peltier elements, new layouts of the power modules, control and modulation techniques for converters. Special attention has been given to an overview of various potential phase change materials which can be considered for high-temperature operations.

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“…Results of the survey can be found in Table II below. Two additional materials, cyanate ester [17] and benzocyclobutene [18], were identified as potential candidates due to their high Tg; however, due to limited commercial availability, they were not included in the following survey or testing.…”

Section: B Potential Materialsmentioning

confidence: 99%

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Lyon,

DiMarino

2023

IMAPSource Proceedings

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With the advent of ultra-wide bandgap (UWBG) semiconductor materials, such as Gallium Oxide (Ga2O3) and Aluminum Nitride (AlN), higher temperature and higher voltage operation of power devices is becoming realizable. However, conventional polymeric and organic encapsulant materials are typically limited to operating temperatures of 200 °C and below. In this work, six materials were identified and evaluated as candidates for use as encapsulants for operation and high-voltage insulation at and above 250 °C. High-temperature silicone gel was used as a reference material and was compared to five novel encapsulants including an epoxy resin, a hydro-set cement, two low melting point glass compounds, and a ceramic potting compound. Gas pycnometry was utilized to evaluate the voiding concentration to avoid partial discharge. Each material was then processed onto a direct-bonded-aluminum (DBA) substrate test coupon to evaluate compatibility with a commonly used metal-ceramic substrate and processability for use in a power module. The insulation capability of each material was evaluated by testing the partial discharge inception voltage (PDIV) across a 1mm gap etched in the substrate. The dielectric stability was then tested by soaking the materials in air at 250 °C for various intervals and observing the degradation of their PDIVs and appearances. The results of each test were compared, and conclusions were drawn about each material’s feasibility for use as a dielectric encapsulation material for a power module operating at temperatures exceeding 200 °C.

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High-temperature endurable encapsulation material

Cited by 8 publications

References 3 publications

A Review of SiC Power Module Packaging: Layout, Material System and Integration

A Review of SiC Power Module Packaging: Layout, Material System and Integration

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

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