High-Temperature Interaction Between Molten AlSr10 Alloy and Glass-Like Carbon Substrate

Siewiorek, A.; Sobczak, N.; Sobczak, J.; Kudyba, Artur; Kozera, Rafał; Boczkowska, Anna

doi:10.1007/s11665-016-2003-x

Cited by 3 publications

(4 citation statements)

References 27 publications

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“…In all the former studies [ 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 ], no significant work was performed on studying the wetting behavior of liquid Al-Si-Cu alloy in contact with Al dross substrate with particular emphasis on the CP procedure. Hence, the novelty of the present study is first providing wettability information of Al-Si-Cu/Al dross systems, secondly the application of the CP procedure in the Al dross wettability test, and third providing microstructural information of Al-Si-Cu/Al dross systems.…”

Section: Resultsmentioning

confidence: 99%

“…Hence, the novelty of the present study is first providing wettability information of Al-Si-Cu/Al dross systems, secondly the application of the CP procedure in the Al dross wettability test, and third providing microstructural information of Al-Si-Cu/Al dross systems. Literature survey [ 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 , 46 , 47 ] revealed that available papers are mostly concerned with the study of the wettability of pure Al [ 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 ] and its alloys [ 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 ] in contact with various types of substrates, such as Al 2 O 3 [ 29 , 34 ], TiO 2 [ 30 , 34 ], C [ 31 , 38 , 40 , 44 ], NiO [ 32 ], SiC [ 33 , 39 ], ZrO 2 [ <...>…”

Section: Resultsmentioning

confidence: 99%

“…Figure 8 shows the comparison of the present work's results with selected literature, and, as seen, the contact angle measurements in the present work were close to the Al/Al 2 O 3 results [29,34]; this may be due to the existence of Al 2 O 3 as the main non-metallic component in the utilized dross. In all the former studies [29][30][31][32][33][34][35][36][37][38][39][40][41][42][43][44][45][46][47], no significant work was performed on studying the wetting behavior of liquid Al-Si-Cu alloy in contact with Al dross substrate with particular emphasis on the CP procedure. Hence, the novelty of the present study is first providing wettability information of Al-Si-Cu/Al dross systems, secondly the application of the CP procedure in the Al dross wettability test, and third providing microstructural information of Al-Si-Cu/Al dross systems.…”

Section: Wetting Behaviour Of Al Dross Substratementioning

confidence: 99%

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Valorization of Aluminum Dross with Copper via High Temperature Melting to Produce Al-Cu Alloys

et al. 2021

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The valorization of aluminum dross for Al recovery was performed via its mixing with metallic copper to produce Al-Cu alloys. This approach was with the intention of establishing a new smelting process to treat the dross with Cu scrap use. To evaluate the high temperature interaction of the materials, the wettability of a Cu-containing aluminum alloy with the non-metallic components of the dross was studied by the sessile drop method. It was found that the wetting was weak via temperature changes at 973–1373 K, and consequently no proper metal separation occurred. To better separate the metallic and non-metallic phases with larger density differences, a higher Cu portion was considered to obtain a significantly denser metallic phase, and it was found that partial separation of the Al in an Al-Cu alloy is possible. The complete separation of the metallic components of the dross was, however, experienced by the dross and copper melting with the addition of pre-melted calcium aluminate slags at elevated temperatures. It was found that Al-Cu alloys were produced and separated from the adjacent slags, and the aluminum oxide of the dross ended up in the slag phase. Moreover, the characteristics of the produced slags depend on the process charge.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Wetting Behaviour Of Al Dross Substratementioning

confidence: 99%

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Valorization of Aluminum Dross with Copper via High Temperature Melting to Produce Al-Cu Alloys

et al. 2021

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“…The problems of molten zones formation and their subsequent migration over material surface are of interest from the viewpoint of both developing novel technological methods of forming microelectronic structures (Anson et al, 1999;Mills and Su, 2006;Siewiorek et al, 2016;Lischner et al, 2016;Liu et al, 2017;Eisaabadi and Nouri, 2018) and application of such drops as primary working elements of microlenses and reflectors (Shi, 2008;Wang et al, 2011;Zohrabi et al, 2016;He et al, 2019), displays, weighers (Zhongping et al, 1995 Skvortsov et al, 2017). Such processes start to appear at the local rise of temperature produced by high current densities j = 10 9 -10 10 А/m 2 .…”

Section: Introductionmentioning

confidence: 99%

Melt Drops Movement Over Semiconductor Surfaces Controlled by Electric Field

Скворцов¹,

Koryachko²,

Demchenkova³

2019

PTQ

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The problems of molten zones formation and their subsequent migration over material surface are of interest from the viewpoint of developing novel technological methods of forming microelectronic structures. Such drops can be used as primary working elements of microlenses and reflectors, displays, weighers. The aim of this work was experimental studying processes of electromigration of molten silver- and aluminum-based inclusions over surfaces of germanium and aluminum semiconductor crystals. The issues of formation and motion of molten drops over the surfaces of silicon and germanium semiconductor crystals are considered within the framework of the electrocapillary approach. It is shown by an example of Ge-Ag and Si-Al systems that accelerated migration is related to the contribution of an electrocapillary component that relates surface tension force of melt drops to electric potential difference at the interface. The experiment consisted in applying metal grain to the surface of the samples and vacuuming the chamber where excessive pressure and the surface temperature were created. Migration of inclusions by powerful current pulses was initiated. An analysis of the effect of direct current on a drop of melt deposited on the surface of a crystalline matrix was made. An analysis of the droplet composition was carried out using the AES method, the results of which showed the relationship between silver and germanium concentrations. Quantitative evaluations are given for migration rates in systems under direct current flow as well as under pulsed current loads. During the experiment, it was found that the energy required to detach the droplet from the rigid matrix was not consumed. The value of the surface charge transfer density was estimated. The results of the work can be used to develop new technological methods for the formation of microelectronic structures and their use for practical purposes.

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Wetting Behavior and Reactivity of Molten Silicon with h-BN Substrate at Ultrahigh Temperatures up to 1750 °C

Polkowski

Sobczak

Nowak

et al. 2017

J. of Materi Eng and Perform

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For a successful implementation of newly proposed silicon-based latent heat thermal energy storage systems, proper ceramic materials that could withstand a contact heating with molten silicon at temperatures much higher than its melting point need to be developed. In this regard, a non-wetting behavior and low reactivity are the main criteria determining the applicability of ceramic as a potential crucible material for long-term ultrahigh temperature contact with molten silicon. In this work, the wetting of hexagonal boron nitride (h-BN) by molten silicon was examined for the first time at temperatures up to 1750°C. For this purpose, the sessile drop technique combined with contact heating procedure under static argon was used. The reactivity in Si/h-BN system under proposed conditions was evaluated by SEM/EDS examinations of the solidified couple. It was demonstrated that increase in temperature improves wetting, and consequently, non-wetting-to-wetting transition takes place at around 1650°C. The contact angle of 90°± 5°is maintained at temperatures up to 1750°C. The results of structural characterization supported by a thermodynamic modeling indicate that the wetting behavior of the Si/h-BN couple during heating to and cooling from ultrahigh temperature of 1750°C is mainly controlled by the substrate dissolution/reprecipitation mechanism.

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High-Temperature Interaction Between Molten AlSr10 Alloy and Glass-Like Carbon Substrate

Cited by 3 publications

References 27 publications

Valorization of Aluminum Dross with Copper via High Temperature Melting to Produce Al-Cu Alloys

Valorization of Aluminum Dross with Copper via High Temperature Melting to Produce Al-Cu Alloys

Melt Drops Movement Over Semiconductor Surfaces Controlled by Electric Field

Wetting Behavior and Reactivity of Molten Silicon with h-BN Substrate at Ultrahigh Temperatures up to 1750 °C

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