2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2017
DOI: 10.1109/ipfa.2017.8060082
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High temperature nanoprobing application for SRAM soft failure fault isolation

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“…In general, FA is fulfilled by conventional Physical Failure Analysis (PFA) techniques such as Passive Voltage Contrast (PVC), Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), and Transmission Electron Microscope (TEM) [6][7]. However, traditional PFA takes long time to identify defects and limited failures could be analyzed.…”
Section: Introductionmentioning
confidence: 99%
“…In general, FA is fulfilled by conventional Physical Failure Analysis (PFA) techniques such as Passive Voltage Contrast (PVC), Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), and Transmission Electron Microscope (TEM) [6][7]. However, traditional PFA takes long time to identify defects and limited failures could be analyzed.…”
Section: Introductionmentioning
confidence: 99%