High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Bai, John G.; Yin, Jian; Zhang, Zhiye; Lü, Gongxuan; Wyk, J.D. van

doi:10.1109/tadvp.2007.898628

Cited by 148 publications

(52 citation statements)

References 16 publications

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“…To avoid the use of pressure (which requires dedicated tooling), researchers at the Virginia Tech. have presented a silver sintering solution using nanometre-sized powder [23], [24]. This solution gives good results compared to Epoxy-based die attach or Au-Ge solders [25].…”

Section: High Temperature/reliability Packagingmentioning

confidence: 99%

State of the art of high temperature power electronics

Buttay

Planson

Allard

et al. 2011

Materials Science and Engineering: B

329

125

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High temperature power electronics has become possible with the recent availability of silicon carbide devices. This material, as other wide-bandgap semiconductors, can operate at temperatures above 500°C, whereas silicon is limited to 150-200°C. Applications such as transportation or a deep oil and gas wells drilling can benefit. A few converters operating above 200°C have been demonstrated, but work is still ongoing to design and build a power system able to operate in harsh environment (high temperature and deep thermal cycling).

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Section: High Temperature/reliability Packagingmentioning

confidence: 99%

State of the art of high temperature power electronics

Buttay

Planson

Allard

et al. 2011

Materials Science and Engineering: B

329

125

View full text Add to dashboard Cite

show abstract

“…Due to the size effect, the melting point of silver particles in nano and micro scale is far below that of silver bulk [10], [23]- [26]. By applying a certain pressure and temperature of above 220 °C, silver particles will be melted and sintered spontaneously under the effect of liquid phase capillary force.…”

Section: A) Nano Silver Sinteringmentioning

confidence: 99%

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Wang¹

2017

CPSS TPEA

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“…Above 200°C Si devices experience latch-up at reverse bias junctions and leakages [57]. SiC power devices exist with operating temperatures up to 200°C [126][127][128][129], but the maximum temperature of a SiC power module for example is limited to about 150°C [130,131]. A commercial high temperature SiC module has been reported operating at 250°C [132]; however, reservations exist over its reliability above 200°C.…”

Section: Electro Chemical Double Layermentioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

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With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

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High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Cited by 148 publications

References 16 publications

State of the art of high temperature power electronics

State of the art of high temperature power electronics

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Integrated motor drives: state of the art and future trends

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