2007
DOI: 10.1016/j.surfcoat.2007.05.070
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High temperature phase changes and oxidation behavior of Cr–Si–N coatings

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Cited by 57 publications
(42 citation statements)
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“…In vacuum, the phase separation of AlTiN and AlCrN into c-TiN or c-CrN and c-AlN followed by h-AlN formation leads to hardness decreases [4,5]. In addition, in AlCrN and AlCrSiN, annealing involves nitrogen reduction to produce Cr 2 N above 1000 ºC [6,7]. Later the Cr 2 N is oxidized to Cr 2 O 3 , which is consistent with thermodynamic and kinetic studies [7].…”
Section: Introductionsupporting
confidence: 83%
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“…In vacuum, the phase separation of AlTiN and AlCrN into c-TiN or c-CrN and c-AlN followed by h-AlN formation leads to hardness decreases [4,5]. In addition, in AlCrN and AlCrSiN, annealing involves nitrogen reduction to produce Cr 2 N above 1000 ºC [6,7]. Later the Cr 2 N is oxidized to Cr 2 O 3 , which is consistent with thermodynamic and kinetic studies [7].…”
Section: Introductionsupporting
confidence: 83%
“…In addition, in AlCrN and AlCrSiN, annealing involves nitrogen reduction to produce Cr 2 N above 1000 ºC [6,7]. Later the Cr 2 N is oxidized to Cr 2 O 3 , which is consistent with thermodynamic and kinetic studies [7].…”
Section: Introductionsupporting
confidence: 80%
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“…The deposition rate of the films decreased from 30.16 nm/min to 25.66nm/min with an increase of the substrate temperature from 200 o C to 400 o C. The deposition in a pure nitrogen environment leads to a low deposition rate owing to the nitride mode. The observed lower deposition rate at a higher substrate temperature, despite the higher adatom mobility during the nitride mode of deposition, is probably due to an increased collision between the sputtered particle and the gas atom, leading to a reduced number of atoms to arrive on the substrate [48]. The lower deposition rates at higher substrate temperatures may be due to the balance between the number of atoms arriving on the substrate surface and the atoms leaving from the substrate surface by further evaporation.…”
Section: Effect Of the Substrate Temperaturementioning
confidence: 95%
“…It has been found that the addition of other elements such as silicon (Si) in MeN systems can have profound effects on their mechanical, chemical and tribological properties [11,14,[221][222][223][224][225]. These changes have been explained by two main mechanisms: the formation of a nanocomposite microstructure formed by the segregation of MeN grains separated by a monolayer thick SiN x matrix [14,221,223] and solid solution hardening [11,222] due to the substitution of Me atoms by Si in the MeN lattice.…”
Section: A1 Introductionmentioning
confidence: 99%