High-temperature phthalonitrile matrix containing silane fragments

Terekhov, V.E.; Bogolyubov, A. A.; Morozov, Oleg S.; Afanaseva, Ekaterina S.; Bulgakov, Boris A.; Babkin, Alexander V.; Кепман, А. В.; Авдеев, В. В.

doi:10.1016/j.mencom.2020.11.036

Cited by 11 publications

(4 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…13,14 The introduction of flexible structures like aromatic ether, novolac segments, and siloxanes can decrease the melting temperatures of phthalonitrile resins. [15][16][17][18][19][20] The effect of crosslinking density on the properties of the resins has also aroused a lot of interest. Jiao et al 21 prepared novel polyimides containing chlorine atoms in which the interchain crosslinking produced by chlorine atom decomposition could occur.…”

Section: Introductionmentioning

confidence: 99%

“…For example, flexible phenyl ether structures were introduced into the backbone of thermosetting polyimides to improve the processability 13,14 . The introduction of flexible structures like aromatic ether, novolac segments, and siloxanes can decrease the melting temperatures of phthalonitrile resins 15–20 . The effect of crosslinking density on the properties of the resins has also aroused a lot of interest.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations

Li,

Gong,

et al. 2023

J of Applied Polymer Sci

View full text Add to dashboard Cite

A series of poly(methylsilane arylether arylacetylene) (PSEA‐H) resins were synthesized from methyldichlorosilane and isomeric arylether arylacetylenes, and characterized by 1H‐NMR and FT‐IR spectroscopies. The effect of reactive Si‐H groups and the linking positions of benzene rings in the arylether arylacetylene units on the properties of the resins were investigated. The results show that PSEA‐H resins possess good processability with processing windows of over 80°C. The introduction of Si‐H groups reduces the curing temperatures for PSEA‐H resins and weakens the secondary relaxation for the cured PSEA‐H resins. The cured resins and T300 carbon fiber (T300CF) reinforced composites display high mechanical properties. The flexural strengths of a cured PSEA‐H resin and its T300CF composite at room temperature reach 64.2 and 426.5 MPa, respectively. The flexural properties depend on the linking positions of benzene rings. The cured PSEA‐H resins show excellent heat resistance with a temperature of 5% weight loss (Td5) above 500°C.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations

Li,

Gong,

et al. 2023

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…Phthalonitrile thermosets were studied as matrices for carbon fiber composites operating at elevated temperatures because of their high glass transition temperatures reaching 530 С, [15][16][17][18][19] elasticity moduli up to 7.2 GPa, 7,20,21 decomposition temperatures over 500 C, [22][23][24] water absorption in the range of 1.8-2.5%, 24,25 LOI values of 43.5-48.5% 24,26,27 and even nuclear shielding properties. 28 This extraordinary combination of properties makes phthalonitrile matrix composites attractive for applications in aerospace, naval and automotive industries.…”

Section: Introductionmentioning

confidence: 99%

Effect of post‐curing temperature on the retention of mechanical strength of phthalonitrile thermosets and composites after a long‐term thermal oxidative aging

Lobanova,

Aleshkevich,

Babkin

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

This work concerns the thermal‐oxidative aging behavior of phthalonitrile thermosets and composites at 280–350°C. The easy‐to‐process resin containing bis(3‐[3,4‐dicyanophenoxy]phenyl)phenyl phosphate with APB as curing agent and the resin‐based composites post‐cured at 330°C, 350°C, and 375°C were studied. The phthalonitrile thermosets post‐cured at 330°C retained flexural strength of 77 MPa after 200 h of thermal aging at 280°C and 37 MPa (40%) after the same time at 300°C while the resins post‐cured at 350°C and 375°C lost over 80% of the flexural strength in these experiments. The same trend of faster oxidation of the samples post‐cured at higher temperatures was observed for the composites. For the first time, crosslinking reactions were observed during the aging, despite the aging temperatures being below the Tg of thermosets. Thus, the work shows a high long‐term thermal oxidative stability of the studied phthalonitrile resins at temperatures up to 300°C and fast destruction of the materials at 350°C despite the resin decomposition temperatures determined by dynamic TGA being over 500°C. The work has shown the negative effect of high‐temperature post‐curing on the operating properties of the phthalonitrile composites as constructive materials for long‐term application at elevated temperatures.Highlights Oxidation of phthalonitrile thermoset occurs at temperatures over 300°C in air. Increase in post‐curing temperature decreases thermal oxidation resistance. Thermosets retained up to 77% of flexural strength after 200 h aging at 300°C. Composites retained over 90% of ILSS after 200 h of aging at 300°C.

show abstract

“…Thermal polymerization of phthalonitriles requires an initiator, such as aromatic amine or phenol, occurs with formation of isonoindoline, triazine, and phthalocyanine structures, and yields thermosets with extraordinarily high heat resistance ( T g up to 450 °C and T 5% > 500 °C), which are considered to be promising matrices for composites for operation under extreme conditions. − However, to the best of our knowledge, there have been no reports of utilizing PN resins for selective photocuring via 3D printing. Phthalonitrile resins are known for poor processability due to high melting points of the monomers, as well as high curing temperatures. ,,− High crystallinity (and, as a consequence, high melting points) might lead to low solubility in different solvents while it is necessary to dissolve solid phthalonitrile monomers in photopolymerizable comonomers to perform VP. − Moreover, phthalonitrile polymerization is typically initiated with an aromatic diamine, which can potentially act as an inhibitor for free-radical polymerization, hindering VP processing . Recently, our research group has successfully designed a low-melting and self-curing phthalonitrile monomer grafted with a maleimide group 4-[3-(2,5-dione-1 H -pyrrole-1-yl)phenoxy]benzene-1,2-dicarbonitrile (PNB-M) .…”

Section: Introductionmentioning

confidence: 99%

Heat-Resistant Phthalonitrile-Based Resins for 3D Printing via Vat Photopolymerization

Nechausov

Aleksanova

Morozov

et al. 2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

In this study, a maleimide/phthalonitrile bifunctional monomer PNB-M was used in vat photopolymerization via the maleimide group to obtain phthalonitrile-containing polymers suitable for further thermal postcuring. A high concentration (40 wt %) and low viscosity (less than 500 mPa·s at 25 °C) photopolymer resin was prepared from the phthalonitrile monomer PNB-M with 4-acryloylmorpholine as comonomer and trimethylolpropane trimethacrylate as cross-linker. Photo-DSC, NMR, and FTIR tests revealed free-radical photoinduced copolymerization of the maleimide with the acrylic groups during 3D printing. Postprinting thermal curing of the phthalonitrile groups was performed with different curing agents as well as via self-initiation by PNB-M. The developed phthalonitrile-containing polymerizable compositions made it possible to increase glass transition temperatures of the 3D printed polymer materials up to 351 °C after additional thermal postcuring. Moreover, mechanical properties of the 3D printed materials have been improved after curing of the phthalonitrile monomer in the maleimide–acrylate copolymer.

show abstract

High-temperature phthalonitrile matrix containing silane fragments

Cited by 11 publications

References 20 publications

High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations

High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations

Effect of post‐curing temperature on the retention of mechanical strength of phthalonitrile thermosets and composites after a long‐term thermal oxidative aging

Heat-Resistant Phthalonitrile-Based Resins for 3D Printing via Vat Photopolymerization

Contact Info

Product

Resources

About