High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates

Lahokallio, Sanna; Kiilunen, Janne; Frisk, Laura

doi:10.1016/j.microrel.2014.07.095

Cited by 10 publications

(9 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This was a clear indication of the fragility of the samples, which would cause reliability problems in actual use conditions of the sensor components. However, the delamination and cracking seen with the Rogers PCBs were less than that seen with similar attachments made with a polyimide substrate, showing the importance of the substrate material for reliability [ 29 , 30 ].…”

Section: Resultsmentioning

confidence: 99%

“…Additionally, a lot of pure copper was still seen even after 2400 h of aging at 200 °C. Compared to the identical samples with PI, the Rogers PCBs had less copper corrosion and it started to form later [ 29 , 30 ]. With the Rogers PCB, at both temperatures the corrosion started from the bottom of the pad at the interface between the substrate material and the copper pad ( Figure 12 ).…”

Section: Resultsmentioning

confidence: 99%

“…They were designed for use in electronics and flip chip applications and not specifically designed for use at high temperatures. The ACFs were chosen on the basis of earlier studies [ 29 , 30 , 31 , 32 ]. Table 1 presents particle sizes and filler types as well as the film thicknesses of the ACFs.…”

Section: Methodsmentioning

confidence: 99%

“…Exceeding the T g may still cause considerable reliability concerns, such as decreased stiffness [ 20 ] and post-curing, leading to brittleness [ 21 , 22 ]. Both promising and discouraging results for using polymer-based adhesive interconnection materials have been reported, but the field is not widely studied [ 2 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 ].…”

Section: Introductionmentioning

confidence: 99%

“…In our earlier studies the reliability results have been promising for ACF attachments with PI substrates [ 29 , 30 , 31 , 32 ]. However, problems caused by oxidation and degradation were found for the PI substrate.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

High-Temperature Storage Testing of ACF Attached Sensor Structures

et al. 2015

View full text Add to dashboard Cite

Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readily available than traditional materials. Thus, there is an increasing interest in using low-cost polymer materials in high temperature applications. This paper studies the performance and reliability of sensor structures attached with anisotropically conductive adhesive film (ACF) on two different organic printed circuit board (PCB) materials: FR-4 and Rogers. The test samples were aged at 200 °C and 240 °C and monitored electrically during the test. Material characterization techniques were also used to analyze the behavior of the materials. Rogers PCB was observed to be more stable at high temperatures in spite of degradation observed, especially during the first 120 h of aging. The electrical reliability was very good with Rogers. At 200 °C, the failures occurred after 2000 h of testing, and even at 240 °C the interconnections were functional for 400 h. The study indicates that, even though these ACFs were not designed for use in high temperatures, with stable PCB material they are promising interconnection materials at elevated temperatures, especially at 200 °C. However, the fragility of the structure due to material degradation may cause reliability problems in long-term high temperature exposure.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%