10th Reliability Physics Symposium 1972
DOI: 10.1109/irps.1972.362553
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High Temperature Reverse Bias Testing at Wafer Level

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“…An approach to wafer testing was presented [52]. This subject received more attention in 1982 with the formation of the wafer-level reliability conferences that have been held annually in the Lale Tahoe IJSA region.…”
mentioning
confidence: 99%
“…An approach to wafer testing was presented [52]. This subject received more attention in 1982 with the formation of the wafer-level reliability conferences that have been held annually in the Lale Tahoe IJSA region.…”
mentioning
confidence: 99%