High temperature solder alloys for underhood applications. Progress report

Drewien, Celeste A.; Yost, F.G.; Sackinger, S.; Kern, Joseph; Weiser, M.

doi:10.2172/91947

Cited by 7 publications

(4 citation statements)

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“…6 Also, the SAC solder-joint electrical properties 7,8 appear to be attractive for both surface-mount and ball-grid-array 7,9 assembly methods. Creep strength in both bulk cast microstructures 10 and in (more realistic) solidified solder-joint samples 11 also appears to be advantageous for SAC, compared to binary Sn-Ag and conventional Sn-Pb solders.…”

Section: Introductionmentioning

confidence: 99%

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Anderson

Harringa

2004

Journal of Elec Materi

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The shear strength behavior and microstructural effects after aging for 100 h and 1,000 h at 150°C are reported for near-eutectic Sn-Ag-Cu (SAC) solder joints (joining to Cu) made from Sn-3.5Ag (wt.%) and a set of SAC alloys (including Co-and Fe-modified SAC alloys). All joints in the as-soldered and 100-h aged condition experienced shear failure in a ductile manner by either uniform shear of the solder matrix (in the strongest solders) or by a more localized shear of the solder matrix adjacent to the Cu 6 Sn 5 interfacial layer, consistent with other observations. After 1,000 h of aging, a level of embrittlement of the Cu 3 Sn/Cu interface can be detected in some solder joints made with all of the SAC alloys and with Sn-3.5Ag, which can lead to partial debonding during shear testing. However, only ductile failure was observed in all solder joints made from the Co-and Fe-modified SAC alloys after aging for 1,000 h. Thus, the strategy of modifying a strong (high Cu content) SAC solder alloy with a substitutional alloy addition for Cu seems to be effective for producing a solder joint that retains both strength and ductility for extended isothermal aging at high temperatures.

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Section: Introductionmentioning

confidence: 99%

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Anderson

Harringa

2004

Journal of Elec Materi

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“…4 Prior calorimetric studies 5 revealed the very similar melting behavior of several closely related Sn-Ag-Cu alloys, consistent with the phase-diagram studies 6 on this system. Compared to other common choices, the Cu alloy addition to Sn-Ag is abundant and low cost, e.g., lower cost than In (and even Sn), is compatible with common no-clean paste fluxes, 7 and is not a byproduct of Pb mining, e.g., unlike Bi and Sb.…”

Section: Introductionmentioning

confidence: 99%

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Anderson

Cook

Harringa

et al. 2002

Journal of Elec Materi

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Slow cooling (1-3°C/sec) of Sn-Ag-Cu and Sn-Ag-Cu-X (X ϭ Fe, Co) solder-joint specimens, made by hand soldering, simulated reflow in a surface-mount assembly to achieve similar as-solidified joint microstructures for realistic shearstrength testing, using Sn-3.5Ag (wt.%) as a baseline. Consistent with predictions from a recent Sn-Ag-Cu ternary phase-diagram study, either Sn dendrites, Ag 3 Sn primary phase, or Cu 6 Sn 5 primary phase were formed during solidification of joint samples made from the selected near-eutectic Sn-Ag-Cu alloys. Minor substitution of Co for Cu in Sn-3.7Ag-0.9Cu refined the joint-matrix microstructure by an apparent catalysis effect on the Cu 6 Sn 5 phase, whereas Fe substitution promoted extreme refinement of the Sn-dendritic phase. Ambient-temperature shear strength was reduced by Sn dendrites in the joint microstructure, especially coarse dendrites in solute poor Sn-Ag-Cu, e.g., Sn-3.0Ag-0.5Cu, while Sn-3.7Ag-0.9Cu with Co and Fe additions have increased shear strength. At elevated (150°C) temperature, no significant difference exists between the maximum shear-strength values of all of the alloys studied.

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“…For this reason, the eutectic between Cu and Al particles (T = 821 K) is not formed and does not contribute to the rapid mutual alloying. Cu can dissolve in a liquid Sn, but only after the preliminary formation of intermetallic layers with η-phase Cu 6 Sn 5 on the interphase boundary [8,9]. Also, particles of η-phase and ε-phase (Cu 3 Sn) may fall out in the supersaturated melt, especially during its crystallization [8].…”

Section: Results and Their Discussionmentioning

confidence: 99%

“…Cu can dissolve in a liquid Sn, but only after the preliminary formation of intermetallic layers with η-phase Cu 6 Sn 5 on the interphase boundary [8,9]. Also, particles of η-phase and ε-phase (Cu 3 Sn) may fall out in the supersaturated melt, especially during its crystallization [8]. As a result, the hardness of Sn-Cu alloy increases, but its ductility decreases sharply, and a fracture location in such alloys depends on the size of the intermetallic particles [9].…”

Section: Results and Their Discussionmentioning

confidence: 99%

Effect of Copper Additives on Mechanical and Tribotechnical Properties of Sintered Composites Al-Sn

Русин

Скоренцев

Gurskikh

2016

KEM

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The mechanical and tribotechnical properties of sintered composites Al-Sn with small copper additives were studied. The sintering of compacts of pure metal powders mixture conducted in the vacuum furnace. It was established that copper additions up to 2% (wt.) lead to a significant increase in the strength and sharp decrease in a plasticity of Al-Sn composites. Because last, only Al-20Sn-1Cu alloy samples saved the integrity under the multiple equal channels angular pressing. The strength of treated samples significantly increased, but their compressive deformation did not exceed 0.5%. The wear intensity of Al-Sn-Cu samples under the dry friction was higher in comparison with Al-Sn composites.

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High temperature solder alloys for underhood applications. Progress report

Abstract: Sanda Nabonal Laboratories Albuquerque, New Mexico 87185 and Livermore, California 94550 for the United States Depamnent of Energy rnder Contract DE-AC04-94AL85000 Approved for public release; dstribution is unlimited.

Cited by 7 publications

References 0 publications

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Effect of Copper Additives on Mechanical and Tribotechnical Properties of Sintered Composites Al-Sn

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