High temperature soldering of SiC particulate aluminium matrix composites (series 2000) using Zn–Al filler alloys

Abstract

The present paper evaluates the solderability of three discontinuously reinforced aluminium matrix composites. The tested composites were an aluminium alloy of the 2000 series (AA2014) reinforced with different percentages of silicon carbide particles (6, 13, and 20 vol.-% respectively). A similar study was carried out on the unreinforced aluminium alloy for comparative purposes. Three low temperature filler alloys of the Zn–Al system were used for soldering. Drop formation tests were performed to evaluate the wettability of the molten filler alloys and sample joints (single overlap specimens) were produced to determine solder penetration in the joint clearance. Microstructural studies of the joints were carried out to determine the effects of the solid reinforcement particles on molten pool behaviour and solidification mechanisms.

Ultrasonic-Assisted Semi-Solid Forming Method and Microstructure Evolution of Aluminum/Copper Brazed Joints

“…The main advantage of the filler metal is that zinc metal and Cu and Al metal all had a very good solubility, which form good metallurgical combination easily, and the same time the Zn-Al alloy has good toughness and corrosion resistance. The Zn-Al filler [10] is a medium temperature solder and the eutectic temperature is about 380 • C, which can basically adapt all Al alloy brazing [11] connection and can avoid stress cracks resulted from the high temperature brazing and substrate metals ablation. Zn alloy has good thermal and electrical conductivity, which meeting the needs of Al/Cu connector performance.…”

Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg

“…For soldering such materials, Al-, Zn-, Snand Bi-based solders may be used. [5][6][7] Great attention is devoted to these materials and the possibilities of their joining at universities as well as other research facilities.…”

Behaviors of Oxide Film during Semisolid Brazing of SiCp/6063Al Composite Materials

“…However, the presence of the surface oxides is the main barrier to successful bonding. erefore, conventional brazing methods are normally conducted in vacuum [1,2] or with flux to reduce the high-temperature oxidation of the faying surfaces. However, joining processes in vacuum increase the overall bonding time and reduce the design flexibility of the parts to be joined; besides, the residual flux is hard to be removed, which could result in a severe corrosive problem.…”