High-temperature tensile and creep behavior of Cu–Nb composites: A discrete dislocation plasticity investigation

Shishvan, Siamak Soleymani

doi:10.1016/j.ijplas.2020.102876

Cited by 14 publications

(3 citation statements)

References 47 publications

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“…Nanolaminates are studied both theoretically and experimentally on the virtue of their unique properties such as high strength [ 1 , 2 ], high fracture toughness [ 3 , 4 , 5 ], extreme deformability [ 3 , 6 , 7 ], shock resistance [ 8 ], electrical conductivity [ 9 ], high temperature strength retention [ 10 ], high-temperature creep [ 11 ] and high resistance to radiation damage [ 12 ]. These nanolaminates have been used for radiation damage protection [ 13 ], and potential applications include hybrid diffusive–displacive helium outgassing [ 14 ] and structural materials [ 10 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

et al. 2022

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Nanolaminates are extensively studied due to their unique properties, such as impact resistance, high fracture toughness, high strength, and resistance to radiation damage. Varieties of nanolaminates are being fabricated to achieve high strength and fracture toughness. In this study, one such nanolaminate fabricated through accumulative roll bonding (Cu(16)/Nb(16) ARB nanolaminate, where 16 nm is the layer thickness) was used as a test material. Cu(16)/Nb(16) ARB nanolaminate exhibits crystallographic anisotropy due to the existence of distinct interfaces along the rolling direction (RD) and the transverse direction (TD). Nanoindentation was executed using a Berkovich tip, with the main axis oriented either along TD or RD of the Cu(16)/Nb(16) ARB nanolaminate. Subsequently, height profiles were obtained along the main axis of the Berkovich indent for both TD and RD using scanning probe microscopy (SPM), which was later used to estimate the pile-up along the RD and TD. The TD exhibited more pile-up than the RD due to the anisotropy of the Cu(16)/Nb(16) ARB interface and the material plasticity along the TD and RD. An axisymmetric 2D finite element analysis (FEA) was also performed to compare/validate nanoindentation data, such as load vs. displacement curves and pile-up. The FEA simulated load vs. displacement curves matched relatively well with the experimentally generated load–displacement curves, while qualitative agreement was found between the simulated pile-up data and the experimentally obtained pile-up data. The authors believe that pile-up characterization during indentation is of great importance to documenting anisotropy in nanolaminates.

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Section: Introductionmentioning

confidence: 99%

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

et al. 2022

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“…While, to the authors' knowledge, there has not yet been a proposed modeling approach that has addressed both material strength and conductivity simultaneously, there have been several studies addressing microstructural effects on strength and conductivity separately. Strength behavior in ADB and ARB Cu/Nb materials has been studied extensively with different modeling approaches [21,[31][32][33][34][35]. Relatively fewer modeling studies have focused on conductivity, although there have been some addressing conductivity in both ADB Cu/Nb [16,[36][37][38] and ARB Cu/Nb [13] systems specifically, along with other studies aimed at two-phase materials more broadly [39,40].…”

Section: Introductionmentioning

confidence: 99%

Predicting electrical conductivity in Cu/Nb composites: a combined model-experiment study

Blaschke,

Miller,

Mier

et al. 2022

Preprint

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The generation of high magnetic fields requires materials with high electric conductivity and good strength properties. Cu/Nb composites are considered to be good candidates for this purpose. In this work we aim to predict, from theory, the dependence of electric conductivity on the microstructure, most notably on the layer thickness and grain sizes. We also conducted experiments to calibrate and validate our simulations. Bimetal interfaces and grain boundaries are confirmed to have the largest impact on conductivity in this composite material. In this approach, a distribution of the layer thickness is accounted for in order to better model the experimentally observed microstructure. Because layer thicknesses below the mean free path of Cu significantly degrade the conductivity, an average layer thickness larger than expected may be needed to meet conductivity requirements in order to minimize these smaller layers in the distribution. We also investigate the effect of variations in volume fraction of Nb and temperature on the material's conductivity.

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“…Copper matrix composites with good conductivity and high strength are important materials in many fields, such as metallurgy, energy, transportation, information, electronics, electromechanical and so on [1,2]. Cu-Fe composites have attracted extensive attention of researchers because of its low cost [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Impact of cryogenic treatment on the microstructure and properties of a thermo-mechanically processed Cu-11Fe composite

Liu

Jin

et al. 2022

J. Phys.: Conf. Ser.

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The conductivity and strength of Cu-Fe composites are contradictory. Cryogenic treatment is a promising process to improve the conductivity and strength of materials at the same time. The impact of cryogenic treatment on a thermo-mechanically processed Cu-11Fe composite was studied using a digital micro-ohmmeter, a tensile testing machine and optical microscopy. The average size of the iron grain in the cryogenically treating Cu-11Fe alloy decreased and the distribution was more uniform after the cryogenic treatment. The grain refinement and the distribution uniformity increased with improving cryogenic treatment time. The elongation to fracture and tensile strength improved first with increasing cryogenic treatment time to a peak value at 18 h and 12 h respectively, and subsequently tended to be stable at longer cryogenic treatment time. The electrical resistivity decreased first with the increase of cryogenic treatment time, then reached an electrical resistivity valley value at 18 h, and subsequently tended to be stable at longer cryogenic treatment time.

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High-temperature tensile and creep behavior of Cu–Nb composites: A discrete dislocation plasticity investigation

Cited by 14 publications

References 47 publications

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

Crystallographic Anisotropy Dependence of Interfacial Sliding Phenomenon in a Cu(16)/Nb(16) ARB (Accumulated Rolling Bonding) Nanolaminate

Predicting electrical conductivity in Cu/Nb composites: a combined model-experiment study

Impact of cryogenic treatment on the microstructure and properties of a thermo-mechanically processed Cu-11Fe composite

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