High Thermal Conductivity AlN Fillers Using Carbo-thermal-reduction and Nitridation Process

Abstract

Novel aluminum nitride (AlN) fillers with large particle size and round shape were developed using the carbo-thermal reduction and nitridation (CRN) method in this study. They were used as high thermal conductivity fillers for resin composites. Thermal conductivity of epoxy resin filled with the AlN filler could reach 12 W/m K. The fluidity of the epoxy resin filled with the developed AlN filler was improved to 1.3 times that of conventional resin. Also, viscosity of silicon resin filled with the AlN filler was one tenth lower than the conventional AlN filler. The properties and evaluation of the developed AlN filler for high thermal conductivity packaging material have also been discussed.