2023
DOI: 10.1002/pc.27767
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High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Liang Liang,
Yu Feng,
Kailun Yang
et al.

Abstract: Epoxy resin, as an adhesive for the main insulation system of large generators, has excellent insulation properties. But its poor thermal conductivity limits the capacity enhancement of large generators. Forming thermally conductive pathways by using electric field to induce high thermal conductivity fillers in the polymer can effectively improve the thermal conductivity of the composite at low loading condition. In this article, a DC electric field is used in epoxy resin (EP) to induce two‐dimensional inorgan… Show more

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Cited by 4 publications
(2 citation statements)
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“…Polymer-based composites have been extensively explored for this purpose. However, enhancing the low thermal conductivity of polymers necessitates incorporating fillers with high thermal or electrical conductivity, including boron nitride (BN), aluminum nitride (AlN), Al 2 O 3 , graphene oxide (GO), and carbon nanotubes (CNTs). Although these fillers improve the thermal or electrical conductivity, achieving both high EMI SE and the electrical insulation required by electronic packing materials remains difficult. To address this problem, we utilized magnetic particle fillers, , specifically Fe 3 O 4 and MgO nanoparticles.…”
Section: Introductionmentioning
confidence: 99%
“…Polymer-based composites have been extensively explored for this purpose. However, enhancing the low thermal conductivity of polymers necessitates incorporating fillers with high thermal or electrical conductivity, including boron nitride (BN), aluminum nitride (AlN), Al 2 O 3 , graphene oxide (GO), and carbon nanotubes (CNTs). Although these fillers improve the thermal or electrical conductivity, achieving both high EMI SE and the electrical insulation required by electronic packing materials remains difficult. To address this problem, we utilized magnetic particle fillers, , specifically Fe 3 O 4 and MgO nanoparticles.…”
Section: Introductionmentioning
confidence: 99%
“…Pure PU polymer usually possesses extremely low thermal conductivity. So various series of thermally conductive fillers including ceramic, 5,[12][13][14][15] metallic, [16][17][18] and carbon-based conductive fillers [19][20][21][22][23] are introduced to polymer matrix in order to improve the thermal conductivity of materials. However, the modulus mismatch between fillers and polymer matrix leads to the internal stress concentration, the increase of rigidity, and the decrease of flexibility and ductility of composites.…”
Section: Introductionmentioning
confidence: 99%