2012
DOI: 10.1016/j.tca.2012.03.002
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High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

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Cited by 187 publications
(111 citation statements)
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“…It is observed that heat conductivity first increases linearly with the degree of agglomeration, reaches a maximum at the percolation threshold and finally decreases. The raising of conductivity with size (at nanoscale) was confirmed by many authors [46][47][48][49][50][51] in the case of epoxy resin with various fillers and by Prasher et al [31,52] in the case of nanofluids.…”
Section: Final Validation Of Dependence Of the Effective Thermal Condmentioning
confidence: 70%
“…It is observed that heat conductivity first increases linearly with the degree of agglomeration, reaches a maximum at the percolation threshold and finally decreases. The raising of conductivity with size (at nanoscale) was confirmed by many authors [46][47][48][49][50][51] in the case of epoxy resin with various fillers and by Prasher et al [31,52] in the case of nanofluids.…”
Section: Final Validation Of Dependence Of the Effective Thermal Condmentioning
confidence: 70%
“…And vertically aligned AlN could effectively enhance λ value of the AlN/epoxy composite from 0.915 to 1.754 W/mK with 20 vol% AlN fillers. Hong et al [171] adopted hybrid fillers of AlN and BN to increase the thermal conductivities of the epoxy resins. The optimal thermal conductive path was strongly affected by the packing efficiency and interfacial resistance of the AlN and BN fillers, and the maximum λ value of the composites was enhanced to 8.0 W/mK.…”
Section: Alnmentioning
confidence: 99%
“…Ceramic fillers, such as boron nitride, aluminum oxide, aluminum nitride, silica, talc and many others can be used in such cases [1,2,4].…”
Section: Introductionmentioning
confidence: 99%
“…In some instruments, such as LED lamps or integrated memory chips, fast and efficient heat dissipation is a key issue, because the generated heat can raise the temperature of the device over its thermal stability limit. Over the critical temperature lifespan decreases significantly or the instrument may be damaged [4].…”
Section: Introductionmentioning
confidence: 99%