2011
DOI: 10.1021/jp201793d
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High-Throughput Characterization of Surface Segregation in CuxPd1–x Alloys

Abstract: A high throughput methodology for the study of surface segregation in alloys has been developed and applied to the Cu x Pd 1Àx system. A novel offsetfilament deposition tool was used to prepare Cu x Pd 1Àx composition spread alloy films (CSAFs), high throughput sample libraries with continuous lateral composition variation spanning the range x = 0.05À0.95. Spatially resolved low energy ion scattering spectroscopy (LEISS) and X-ray photoelectron spectroscopy (XPS) were used to characterize the films' top-surfac… Show more

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Cited by 47 publications
(87 citation statements)
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“…[38] The values of ΔH seg and ΔS seg at x ~ 0.3 on the CSAF matched those we measured for the single composition Cu 0.3 Pd 0.7 alloy sample, providing validation of the high throughput approach for characterization of segregation phenomena.…”
Section: Introductionsupporting
confidence: 72%
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“…[38] The values of ΔH seg and ΔS seg at x ~ 0.3 on the CSAF matched those we measured for the single composition Cu 0.3 Pd 0.7 alloy sample, providing validation of the high throughput approach for characterization of segregation phenomena.…”
Section: Introductionsupporting
confidence: 72%
“…In our prior high-throughput study of surface segregation on a clean Cu x Pd 1-x CSAF, we observed that Cu preferentially segregates to the top surface of the alloy at all bulk compositions in the range x = 0.05 to 0.95 and temperatures in the range T = 500 -900 K. [38] We used a Langmuir-McLean analysis to extract ΔH seg and ΔS seg , the enthalpy and entropy of Cu segregation to the alloy top-surface, as functions of bulk composition, x, and showed that Cu segregation is exothermic (ΔH seg < 0) over all x. [38] The values of ΔH seg and ΔS seg at x ~ 0.3 on the CSAF matched those we measured for the single composition Cu 0.3 Pd 0.7 alloy sample, providing validation of the high throughput approach for characterization of segregation phenomena.…”
Section: Introductionmentioning
confidence: 88%
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“…[24] and Au x Pd 1-x [25] phase diagrams) by conductive heat transfer from the resistively heated sapphire substrate. The annealing ensured that the CSAFs contained face centered cubic crystalline solid solutions, without intermetallics, across all compositions [26]. After cooling, the chamber was vented to remove the sample for composition and thickness vs. position analysis.…”
mentioning
confidence: 99%